Title:
EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, GAS BARRIER ADHESIVE AGENT, AND GAS BARRIER LAMINATE BODY
Document Type and Number:
WIPO Patent Application WO/2013/161481
Kind Code:
A1
Abstract:
This epoxy resin curing agent contains at least the belowmentioned component (I) and component (II) at a mass ratio (component (I)/component (II)) of 50/50 to 92/8. Component (I) is a reaction product obtained by reacting at least (A) meta-xylylene diamine or para-xylylene diamine and (B) acrylic acid and/or an acrylic acid derivative. Component (II) is a reaction product obtained by reacting at least the aforementioned (A) and (B2) an unsaturated carboxylic acid represented by general formula (1) and/or a derivative thereof. (In formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1-8 carbon atoms, an aralkyl group having 1-8 carbon atoms, or an aryl group. However, at least one of R1 and R2 is an alkyl group having 1-8 carbon atoms, an aralkyl group having 1-8 carbon atoms, or an aryl group.)
Inventors:
HONDA EIICHI (JP)
KOUNO KAZUKI (JP)
KOUNO KAZUKI (JP)
Application Number:
PCT/JP2013/058638
Publication Date:
October 31, 2013
Filing Date:
March 25, 2013
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
HENKEL AG & CO KGAA (DE)
HENKEL AG & CO KGAA (DE)
International Classes:
C08G59/56; B32B15/092; B32B27/38; B65D1/00; B65D30/02; B65D65/40; C09J163/00
Domestic Patent References:
| WO1999060068A1 | 1999-11-25 |
Foreign References:
| JP2009167335A | 2009-07-30 | |||
| JP2004026011A | 2004-01-29 | |||
| JP2008121018A | 2008-05-29 | |||
| JPH1028928A | 1998-02-03 | |||
| JPH0791367B2 | 1995-10-04 | |||
| JPH0791368B2 | 1995-10-04 | |||
| JPH09511537A | 1997-11-18 | |||
| JP2002256208A | 2002-09-11 | |||
| JPH0551574A | 1993-03-02 | |||
| JPH09316422A | 1997-12-09 | |||
| JP2000154365A | 2000-06-06 |
Other References:
See also references of EP 2842983A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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