Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ETCHING SOLUTION FOR RESIN MOLDED BODY AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/056285
Kind Code:
A1
Abstract:
Provided is a technique with which decomposition of permanganic acid can be suppressed at low cost while maintaining the etching performance of the permanganic acid, the technique being achieved by an acidic etching solution including permanganate ion for resin molded bodies, the solution characterized by further including a pH buffer, and an etching method of the resin molded bodies and a method of plating on the resin molded bodies, which use the etching solution.

Inventors:
HORI MASAO (JP)
KURAMOCHI YASUYUKI (JP)
IZUMITANI MIYOKO (JP)
Application Number:
PCT/JP2015/077915
Publication Date:
April 06, 2017
Filing Date:
October 01, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JCU CORP (JP)
International Classes:
C09K13/04; C23C18/24
Domestic Patent References:
WO2007122869A12007-11-01
WO2008132926A12008-11-06
WO2015060196A12015-04-30
Foreign References:
JP2000315862A2000-11-14
JP2008031513A2008-02-14
Attorney, Agent or Firm:
The Patent Corporate body of Ono & Co. (JP)
Patent business corporation Ono international patent firm (JP)
Download PDF: