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Patent Searching and Data


Title:
ETHYLENE-BASED COPOLYMER COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/085225
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a composition that can be used to produce a cross-linked foam body which is suitable for use in footwear components such as soles, and which has an excellent balance of characteristics such as light weight, heat shrinkage, compression set, and mechanical strength; a foam body using the composition; and a footwear component using the foam body. This ethylene-based copolymer composition is characterized by containing: an ethylene-based copolymer (A) satisfying all requirements (A-a), (A-b), (A-c), and (A-d); a copolymer rubber (B) of ethylene, an α-olefin having 3-20 carbon atoms, and a non-conjugated polyene; and optionally an ethylene-polar monomer copolymer (C). (A-a) The vinyl group content per 1000 carbon atoms is 0.025-0.3. (A-b) MFR10/MFR2.16 is 7-20. (A-c) The density is 0.850-0.910 g/cm3. (A-d) The melt flow rate is 0.01-200 g/10 min.

Inventors:
SAKAI TATSUYA (JP)
NODA KIMINORI (JP)
KAMIYA NOZOMI (JP)
Application Number:
PCT/JP2020/039320
Publication Date:
May 06, 2021
Filing Date:
October 20, 2020
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L23/04; A43B13/04; A43B13/12; B32B5/18; C08F210/02; C08F210/16; C08F210/18; C08J9/04; C08L23/16
Domestic Patent References:
WO2007132731A12007-11-22
WO2015129414A12015-09-03
WO2007132731A12007-11-22
WO2015129414A12015-09-03
Foreign References:
JP2008308619A2008-12-25
JPH1036580A1998-02-10
JP2014526576A2014-10-06
JP2006249136A2006-09-21
JP2008308619A2008-12-25
JP2015521670W
US4960878A1990-10-02
US5041584A1991-08-20
JPH0278687A1990-03-19
JPH051950A1993-01-08
JPH052036A1993-01-08
JPH03179005A1991-08-05
JPH03179006A1991-08-05
JPH03207703A1991-09-11
JPH03207704A1991-09-11
US5321106A1994-06-14
JP2004051676A2004-02-19
Other References:
TOSO RESEARCH AND TECHNOLOGY REPORT, vol. 47, 2003, pages 55
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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