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Patent Searching and Data


Title:
ETHYLENE RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2021/200991
Kind Code:
A1
Abstract:
According to the present invention, an ethylene resin composition which satisfies the requirements (1) to (4) as a material for packaging materials and the like enables the achievement of a film that has an excellent balance between the strength for protecting the contents and the stiffness (openability upon filling of the contents into a packaging material, free-standing properties and the like). (1) The melt flow rate (at 190°C under a load of 2.16 kg) is from 0.1 g/10 min to 1.0 g/10 min. (2) The density is from 915 kg/m3 to 935 kg/m3. (3) The melt index (I21 at 190˚C under a load of 2.16 kg) is 45 or less. (4) The ratio of the amount of melting heat (Hh) as determined from the DSC curve at 120°C or higher to the total amount of melting heat (Ht) as determined from the DSC curve of the DSC measurement, namely, the amount of melting heat ratio (Hh/Ht) at 120°C or higher is from 10% to 55%.

Inventors:
SEKIYA KEIKO (JP)
SUZUKI MASAO (JP)
KUDO YUTA (JP)
Application Number:
PCT/JP2021/013614
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
PRIME POLYMER CO LTD (JP)
International Classes:
B32B27/32; C08F10/02; C08J5/18; C08L23/08
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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