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Title:
EXTERNAL TERMINAL FOR SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2020/213214
Kind Code:
A1
Abstract:
[Problem] To make it easier to cause an external terminal to deform by changing the lateral bending strength and shear strength of a terminal body part. [Solution] This invention is provided with a soldered bottom part and a terminal body part folded vertically from the bottom part. The terminal body part has a first groove on the left end part side directly above the part at which the terminal body part is folded from the bottom part, and a second groove on the right end part side directly above the part at which the terminal body part is folded from the bottom part. The first groove and the second groove are asymmetric about a center line passing through the terminal body part in the vertical direction.

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Inventors:
MORI HIROKO (JP)
Application Number:
PCT/JP2019/050285
Publication Date:
October 22, 2020
Filing Date:
December 23, 2019
Export Citation:
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Assignee:
SANSHA ELECTRIC MFG CO LTD (JP)
International Classes:
H01L23/04; H01L23/12; H01L23/28; H01L23/48; H01L25/07; H01R12/71; H05K1/18
Domestic Patent References:
WO2017122471A12017-07-20
Foreign References:
JP2015201505A2015-11-12
JP2003115337A2003-04-18
JP2007073782A2007-03-22
JP2013140862A2013-07-18
JP2019009183A2019-01-17
JPS59110146A1984-06-26
JP2015046416A2015-03-12
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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