Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILAMENT, STRUCTURE, RESIN COMPOSITION, AND METHOD FOR PRODUCING FILAMENT
Document Type and Number:
WIPO Patent Application WO/2022/074966
Kind Code:
A1
Abstract:
Provided are a filament including a polyamide resin, wherein the filament has high strength and a high retention rate of mechanical properties after water absorption; a structure; a resin composition; and a method for producing a filament. The filament includes a polyamide resin; the polyamide resin is constituted from diamine-derived constituent units and dicarboxylic acid-derived constituent units; 70 mol% or more of the diamine-derived constituent units are derived from a xylylene diamine; 70 mol% or more of the dicarboxylic acid-derived constituent units are derived from a C11-14 α,ω-straight-chain aliphatic dicarboxylic acid; the content of compounds having a molecular weight of from 310 to 1000 is from 0.1 mass% to 1.5 mass%; and the content of compounds having a molecular weight of less than 310 is 0.1 mass% or less.

Inventors:
YAMANAKA MASAKI (JP)
MATSUMOTO NOBUHIKO (JP)
Application Number:
PCT/JP2021/032063
Publication Date:
April 14, 2022
Filing Date:
September 01, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G69/26; D01F6/60; D01F6/80
Domestic Patent References:
WO2014132775A12014-09-04
WO2020250564A12020-12-17
WO2019163062A12019-08-29
WO2017010389A12017-01-19
Foreign References:
JP2014240146A2014-12-25
JPS4863050A1973-09-03
JP2002339163A2002-11-27
JPS6254725A1987-03-10
JP2011527369A2011-10-27
JP4894982B12012-03-14
JP2010281027A2010-12-16
JP2016223037A2016-12-28
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: