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Patent Searching and Data


Title:
FILAMENT FOR THREE-DIMENSIONAL PRINTING
Document Type and Number:
WIPO Patent Application WO/2021/066102
Kind Code:
A1
Abstract:
The present invention pertains to a filament for three-dimensional printing, the filament containing an olefin-based resin composition (α) satisfying 700≥24×ΔHc(α)-E'(α). ΔHc(α) is the heat of crystallization (J/g) of the olefin-based resin composition (α) as measured at a cooling rate of 10 °C/min by a differential scanning calorimeter, and E'(α) is the storage modulus (MPa) of the olefin-based resin composition (α) as measured with 10 Hz at 40°C.

Inventors:
HIRANO AKIKO (JP)
SANO JIRO (JP)
Application Number:
PCT/JP2020/037443
Publication Date:
April 08, 2021
Filing Date:
October 01, 2020
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B33Y30/00; B29C64/118; B29C64/259; B29C64/314; B33Y70/00; B33Y80/00
Foreign References:
JP2019130864A2019-08-08
JP2017197627A2017-11-02
JP2018035461A2018-03-08
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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