Title:
FILM HEATING/MOLDING DEVICE OF BLISTER PACKAGING MACHINE
Document Type and Number:
WIPO Patent Application WO/2020/183640
Kind Code:
A1
Abstract:
In order to provide a film heating/molding device of a blister packaging machine with which it is possible to perform molding without extreme reduction in the sheet thickness of a pocket upper-surface portion, adopt a configuration of superposition without warping, and conduct stable molding at high speed, the present invention is configured so that a compressed-air injection mechanism disposed on a mold 5A side comprises a compressed-air injection hole 53a that opens in the inner bottom part of a pocket hole 52 in the mold 5A, and a compressed-air injection hole 53b that opens in the periphery of the pocket hole 52 in the mold 5A.
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Inventors:
KODAI TAKESHI (JP)
IKEUCHI KENSUKE (JP)
IKEUCHI KENSUKE (JP)
Application Number:
PCT/JP2019/010224
Publication Date:
September 17, 2020
Filing Date:
March 13, 2019
Export Citation:
Assignee:
MUTUAL CORP (JP)
International Classes:
B65B47/08; B29C51/10; B29C51/42; B65B11/52; B65B47/02
Foreign References:
| JP2003095220A | 2003-04-03 | |||
| JP2006346979A | 2006-12-28 | |||
| JP2008055622A | 2008-03-13 | |||
| JP2013028047A | 2013-02-07 | |||
| JP2014024309A | 2014-02-06 | |||
| JP2012250379A | 2012-12-20 |
Attorney, Agent or Firm:
MORI, Osamu (JP)
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