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Patent Searching and Data


Title:
FILM FORMATION METHOD AND ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/138331
Kind Code:
A1
Abstract:
A film formation method whereby a film comprising a curable composition is formed. The film formation method includes: an arrangement step in which the curable composition is arranged upon an undercoat layer of a substrate that has a base material and the undercoat layer disposed upon the base material; a contact step in which, after the arrangement step, the curable composition and a mold are caused to contact; a curing step in which, after the contact step, the curable composition is cured; and a separation step in which, after the curing step, the curable composition and the mold are separated. In the contact step, a gas is present that fills a gap between the undercoat layer and the mold. The solubility coefficient for the gas, relative to the undercoat layer, is 0.5 kg/m3·atm to 10 kg/m3·atm.

Inventors:
ITO YUTO (JP)
ITO TOSHIKI (JP)
KAWATA ISAO (JP)
Application Number:
PCT/JP2021/046063
Publication Date:
June 30, 2022
Filing Date:
December 14, 2021
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Foreign References:
JP2012507140A2012-03-22
JP2012000992A2012-01-05
JP2011041938A2011-03-03
JP2011505270A2011-02-24
JP2003222592A2003-08-08
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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