Title:
FILM-LAMINATION METHOD, PRINTED CIRCUIT BOARD FILM-LAMINATION METHOD, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/216089
Kind Code:
A1
Abstract:
In this film-lamination method, a workpiece (4) is placed on a receiving tool (3) disposed inside a first chamber (1). A film (5) is set in such a manner that the interior of the first chamber (1) and the interior of a second chamber (2) are delimited. The film (5) is bonded to the surface of the workpiece (4) in a state in which the interior of the first chamber (1) is depressurized to a pressure that is 1/10 of the atmospheric pressure or lower. The portion of the film (5) sticking out from the workpiece (4) is cut off. In the cutting step, the film is cut from a break section (32) at which the main surface of the receiving tool (3) becomes discontinuous, the break section being provided in an outer peripheral section with respect to a plan view of the region of the receiving tool (3) where the workpiece (4) is placed.
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Inventors:
TANABE TSUYOSHI (JP)
ASAYAMA SHINJI (JP)
AJIOKA SHOICHI (JP)
SASAKI SHUNSUKE (JP)
ASAYAMA SHINJI (JP)
AJIOKA SHOICHI (JP)
SASAKI SHUNSUKE (JP)
Application Number:
PCT/JP2019/015473
Publication Date:
November 14, 2019
Filing Date:
April 09, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B29C63/02; B26D7/20; B26F3/02; B32B37/14; B32B38/18; H05K3/28
Foreign References:
| JPH02139221A | 1990-05-29 | |||
| JPH02139222A | 1990-05-29 | |||
| JPS58118681A | 1983-07-14 | |||
| JPS4746029B1 | ||||
| JP2008186937A | 2008-08-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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