FILM LAYER CURING DEVICE

WIPO Patent Application WO/2021/233140

A1

A film layer curing device, comprising: a support platform used for bearing a substrate, a film layer being provided on the surface of the substrate; and a light source assembly located above the support platform, the light source assembly comprising a light source array which is provided facing the support platform and of which the projection covers a light-emitting surface (10) of the whole film layer; and the light source array comprises a plurality of point light sources (11) uniformly distributed on the light-emitting surface (10), and light emitted from the light source array is capable of uniformly irradiating the whole film layer, so as to improve the uniformity of the thickness distribution of the film layer after being cured. According to needs, the light source assembly may be further provided with a reflector (12) used for reflecting light, a sensor (13) used for detecting the light intensity, and a controller (15) used for adjusting the light emission intensity.

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WU TIANCHENG (CN)

PCT/CN2021/092286

November 25, 2021

May 08, 2021

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CHANGXIN MEMORY TECH INC (CN)

B05D3/06

CN111167684A	2020-05-19
CN104084368A	2014-10-08
CN102906497A	2013-01-30
US20170097150A1	2017-04-06
CN102263096A	2011-11-30
CN103706545A	2014-04-09
US20170218208A1	2017-08-03

SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)

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