FILM-LIKE ADHESIVE AGENT, AND ELECTRONIC COMPONENT USING SAME AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2023/026584

A1

A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the light transmittance T1 of the film-like adhesive agent at a wavelength of 400 nm is 90% or less, the light transmittance T2, at a wavelength of 400 nm, of a cured object obtained through thermosetting of the film-like adhesive agent is 85% or more, and T1