Title:
FILM-LIKE ADHESIVE, METHOD FOR EVALUATING EASE OF CUTTING OF SAME, DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/084778
Kind Code:
A1
Abstract:
One aspect of the present disclosure is a method for evaluating the ease of cutting of a film-like adhesive under low-temperature conditions in which cooling expansion is performed, said method including: a step for preparing a specimen having a cross-sectional area A (mm2) from the film-like adhesive; a step for obtaining the cutting work W (N·mm), the cutting strength P (N), and the cutting elongation L (mm) of the specimen by a cutting test under low-temperature conditions in the range of -15°C to 0°C; a step for obtaining a cutting factor m expressed by equation (1); and a step for obtaining the cutting resistance R (N/mm2) expressed by equation (2). Equation (1): m = W/[1000×(P×L)]
Equation (2): R = P/A
Inventors:
YAMANAKA DAISUKE (JP)
KAYA MICHIKO (JP)
KAYA MICHIKO (JP)
Application Number:
PCT/JP2020/013478
Publication Date:
May 06, 2021
Filing Date:
March 25, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/52; C09J7/38; H01L21/301
Foreign References:
| JP2019029465A | 2019-02-21 | |||
| JP2009283925A | 2009-12-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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