Title:
FILM FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL STRUCTURE HAVING UNEVEN STRUCTURE, PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR ELECTROFORMING MOLD
Document Type and Number:
WIPO Patent Application WO/2021/079740
Kind Code:
A1
Abstract:
Provided are: a film for three-dimensional molding, capable of applying a fine uneven structure to the surface of a three-dimensional structure, even if the three-dimensional structure is large, and providing excellent precision to the applied fine uneven structure; a three-dimensional structure having an uneven structure and using the film for three-dimensional molding; a production method therefor; and a production method for an electroforming mold using the three-dimensional structure having an uneven structure. The film for three-dimensional molding has: a ductile film; a ductile cured layer positioned upon a first surface of the ductile film, comprising a cured product of a curable resin composition, and having an uneven structure having an average surface pitch of 50 nm–8 µm; and an inorganic layer formed that follows the uneven structure. The film for three-dimensional molding has an elongation at break of at least 10% at 110°C. The inorganic layer comprises at least one type of inorganic material selected from the group consisting of Au, Pt, Pd, Ni, NiP, Cr, and W.
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Inventors:
TANAKA YASUAKI (JP)
SHINOTSUKA KEI (JP)
SHINOTSUKA KEI (JP)
Application Number:
PCT/JP2020/037988
Publication Date:
April 29, 2021
Filing Date:
October 07, 2020
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
B32B15/08; B29C33/38; B32B3/30; B32B7/022
Domestic Patent References:
| WO2013161454A1 | 2013-10-31 |
Foreign References:
| JP2013529146A | 2013-07-18 | |||
| JP2018089891A | 2018-06-14 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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