Title:
FILM, WRAPPING ELECTRIC WIRE COATING MATERIAL, FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/030410
Kind Code:
A1
Abstract:
Provided are: a film that has low dielectric property and excellent flexibility and flex resistance, while maintaining the properties of an aromatic polyether ketone resin (I); and, as obtained by using said film, a wrapping electric wire coating material, a film for a flexible printed circuit board, and a laminate. This film comprises a resin composition containing an aromatic polyether ketone resin (I) and a fluorine-containing copolymer (II). The film is characterized in that the fluorine-containing copolymer (II) has an average dispersion particle size of 5 μm or less and forms a dispersed phase, and the aromatic polyether ketone resin (I) has a degree of crystallinity of less than 6%.
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Inventors:
SEKI TOYOMITSU (JP)
MARUHASHI TAKUMA (JP)
NAKANISHI KOJI (JP)
KONO HIDEKI (JP)
MARUHASHI TAKUMA (JP)
NAKANISHI KOJI (JP)
KONO HIDEKI (JP)
Application Number:
PCT/JP2021/028459
Publication Date:
February 10, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08J5/18; C08L27/12; C08L71/10; H01B3/42; H05K1/03
Domestic Patent References:
| WO2019198771A1 | 2019-10-17 |
Foreign References:
| JP2019183175A | 2019-10-24 | |||
| JP2016079391A | 2016-05-16 | |||
| JP2016029164A | 2016-03-03 | |||
| JP2003082123A | 2003-03-19 | |||
| JP2006274073A | 2006-10-12 | |||
| JP2005313608A | 2005-11-10 | |||
| JP2011046103A | 2011-03-10 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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