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Patent Searching and Data


Title:
FINGERPRINT MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/114266
Kind Code:
A1
Abstract:
Disclosed are a fingerprint module (20) and an electronic device (100). The fingerprint module (20) comprises a circuit board (21), an adhesive (23) and a sensing chip (22), wherein the circuit board (21) is provided with a chip mounting area (211) and an accommodating portion (212) arranged around the chip mounting area (211), the sensing chip (22) is arranged in the chip mounting area (211), and the adhesive (23) is arranged on the accommodating portion (212) and is connected to the periphery of the sensing chip (22). The fingerprint module (20) avoids the problems of the complex structure and high production cost of an existing fingerprint module.

Inventors:
AN HONGPENG (CN)
MA TIEQIU (CN)
ZHONG DONGFANG (CN)
Application Number:
PCT/CN2019/125308
Publication Date:
June 17, 2021
Filing Date:
December 13, 2019
Export Citation:
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Assignee:
NANCHANG O FILM BIO IDENTIFICATION TECH CO LTD (CN)
International Classes:
G06K9/00
Foreign References:
CN206251438U2017-06-13
CN206251438U2017-06-13
CN109710100A2019-05-03
CN207799700U2018-08-31
US9281339B12016-03-08
CN109670373A2019-04-23
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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