Title:
FIXATION STRUCTURE OF WIRING MEMBER, AND WIRING MEMBER WITH HEAT GENERATION LAYER
Document Type and Number:
WIPO Patent Application WO/2021/084861
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology that makes it possible to achieve easy fixation between a wiring member and an adherend. A fixation structure of a wiring member according to the present invention comprises: a wiring member that comprises at least one linear transmission member; a heat generation layer that is provided so as to surround the periphery of the wiring member; an adherend to which the wiring member is affixed; and a bonding layer that is provided between the heat generation layer and the adherend and/or between the heat generation layer and the wiring member. With respect to this fixation structure of a wiring member, the heat generation layer is capable of generating heat by means of induction heating; and the bonding layer develops bondability by means of the heat from the heat generation layer during the induction heating, while being bonded to at least one of the adherend and the wiring member.
Inventors:
KATO HIROTAKA (JP)
HIRAI HIROKI (JP)
HIGASHIKOZONO MAKOTO (JP)
SONE KOSUKE (JP)
HIRAI HIROKI (JP)
HIGASHIKOZONO MAKOTO (JP)
SONE KOSUKE (JP)
Application Number:
PCT/JP2020/031604
Publication Date:
May 06, 2021
Filing Date:
August 21, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/30; C09J7/35; H01B7/40; H05B6/10
Domestic Patent References:
| WO2018235788A1 | 2018-12-27 |
Foreign References:
| JP2002371253A | 2002-12-26 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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