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Title:
FLAKY RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/026818
Kind Code:
A1
Abstract:
A flaky resin composition for encapsulation which comprises (A) an epoxy resin, (B) a phenolic-resin hardener, (C) a hardening accelerator, and (D) an inorganic filler, characterized in that 80 mass% or more of the flaky resin composition for encapsulation is accounted for by a flat-surface-containing resin composition which has a pair of flat parallel surfaces, the distance between the pair of flat surfaces being 150-1,000 μm, and that the content of a flaky resin composition for encapsulation therein which, in classification with JIS standard sieves, passes through a sieve having a nominal opening size of 150 μm is 5 mass% or less and the content of a flaky resin composition for encapsulation therein which, in said classification, does not pass through a sieve having a nominal opening size of 2 mm is 5 mass% or less.

Inventors:
SUDO NOBUHIRO (JP)
Application Number:
PCT/JP2019/028135
Publication Date:
February 06, 2020
Filing Date:
July 17, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
C08L63/00; C08G59/62; C08K3/011; C08K3/013; H01L23/29; H01L23/31
Domestic Patent References:
WO2016030985A12016-03-03
Foreign References:
JP2000290378A2000-10-17
JP2015185759A2015-10-22
JPH1060161A1998-03-03
JP2003155328A2003-05-27
JP2005048173A2005-02-24
JP2018203839A2018-12-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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