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Patent Searching and Data


Title:
FLEXIBLE COMPLIANT INTERCONNECT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2001054232
Kind Code:
A3
Abstract:
A method and apparatus for achieving a fine pitch interconnect between a flexible circuit member and another circuit member with co-planar electrical contacts that have a large range of compliance. The interconnect assembly includes a substrate with one or more compliant raised portions. At least one flexible circuit member having a first surface with a plurality of contact pads and a second surface is provided. The substrate is located along the second surface of the flexible circuit member with the compliant raised portions aligned with the contact pads so that the compliant raised portions bias the contact pads with corresponding contact pads on the first circuit member when in a compressive relationship.

Inventors:
RATHBURN JAMES (US)
Application Number:
PCT/US2001/000872
Publication Date:
March 07, 2002
Filing Date:
January 11, 2001
Export Citation:
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Assignee:
GRYPHICS INC (US)
RATHBURN JAMES (US)
International Classes:
H05K1/18; H01L23/48; H01L23/498; H01R12/00; H01R12/52; H01R12/62; H05K1/14; H05K3/32; H05K3/36; (IPC1-7): H01R12/08
Foreign References:
US5984691A1999-11-16
US4548451A1985-10-22
US5007842A1991-04-16
EP0351851A21990-01-24
US5207585A1993-05-04
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