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Patent Searching and Data


Title:
FLIP-CHIP LED LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2021/047273
Kind Code:
A1
Abstract:
Disclosed is a flip-chip LED light source, comprising a substrate and at least one LED chip, wherein the LED chip is bonded with the front face of the substrate by means of a first surface with an electrode; a second surface of the LED chip is a light emergent face and faces away from the first surface; at least one pair of a P electrode and an N electrode of the at least one LED chip is connected to the front face of the substrate in a thermally-conductive manner by means of a plurality of thermal conductors arranged at intervals; and the maximum size a, in a direction parallel to the first surface, of any one of the thermal conductors is less than the minimum distance d between the P electrode and the N electrode. According to the flip-chip LED light source provided in the present application, a flip-chip bonding technique is combined with a self-aligned isolation technique, such that the chip yield is improved, and the thermal expansion stress of a bonding interface is reduced; moreover, the requirement for the alignment precision of a device is reduced, thereby reducing production costs and improving productivity.

Inventors:
TANG WENTING (CN)
CAI YONG (CN)
Application Number:
PCT/CN2020/101339
Publication Date:
March 18, 2021
Filing Date:
July 10, 2020
Export Citation:
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Assignee:
SUZHOU INST NANO TECH & NANO BIONICS SINANO CAS (CN)
International Classes:
H01L33/64; H01L33/62
Foreign References:
CN210200761U2020-03-27
CN106783816A2017-05-31
CN104979461A2015-10-14
CN107146840A2017-09-08
US20060278885A12006-12-14
US9263655B22016-02-16
Attorney, Agent or Firm:
NANJING LI&FENG INTELLECTUAL PROPERTY AGENCY(SPECIAL GENERAL PARTNERSHIP) (CN)
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