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Title:
FLUORESCENT SUBSTRATE, DISPLAY DEVICE, AND LIGHTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/137764
Kind Code:
A1
Abstract:
A fluorescent substrate according to the present invention has a plurality of light-emitting elements mounted on one surface, and comprises: an insulation substrate; a first electrode group that is positioned on one surface of the insulation substrate and has a plurality of electrodes joined to the plurality of light-emitting elements; and a fluorescent layer that is positioned on one surface of the insulation substrate and includes a fluorescent material in which the emission peak wavelength when light emitted by the light-emitting elements is used as excitation light is in the visible light region. The insulation substrate includes a bismaleimide resin and glass cloth.

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Inventors:
KONISHI MASAHIRO (JP)
Application Number:
PCT/JP2019/049691
Publication Date:
July 02, 2020
Filing Date:
December 18, 2019
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L33/50; F21V9/30; H01L33/62; H05K3/28; F21Y115/10
Domestic Patent References:
WO2010150880A12010-12-29
WO2014181757A12014-11-13
Foreign References:
JP2001148509A2001-05-29
JP2016139632A2016-08-04
JP2016122693A2016-07-07
JP2015198252A2015-11-09
CN103579480A2014-02-12
JP2009267289A2009-11-12
CN106163113A2016-11-23
JP2018244546A2018-12-27
Other References:
KUBOYAMA, NORIHITO; YASUDA, TAKASHI: "An approach to the thermal expansion coefficient of IC chips and excellent cost performance. Printed wiring board materials for semiconductor packages substrates. Newly developed CS-3305A", RISHO NEWS, no. 192, 10 January 2014 (2014-01-10), pages 7 - 9, XP009528684
See also references of EP 3905345A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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