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Title:
FLUORINE-CONTAINING POLYMER, RESIN FILM, AND OPTO-ELECTRONIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/172371
Kind Code:
A1
Abstract:
Provided is a fluorine-containing polymer that is suitable for vapor deposition and for metal patterning. Also provided is a resin film that contains such a fluorine-containing polymer as a material. Also provided is an opto-electronic element having such a resin film in the structure thereof. The fluorine-containing polymer satisfies (1)-(3). (1) The melting point is less than 200°C or no melting point is observed. (2) The thermogravimetric reduction rate when the temperature is increased at a heating rate of 2°C/min at a pressure of 1×10-3 Pa reaches essentially 100% at a temperature of at most 400°C. (3) The temperature range from the temperature at which the thermogravimetric reduction rate is 10% to the temperature at which the thermogravimetric reduction rate is 90% when the temperature is increased at a heating rate of 2°C/min at a pressure of 1×10-3 Pa is within 200°C.

Inventors:
ABE TAKEFUMI (JP)
TSURUOKA KAORI (JP)
SHIMOHIRA TESUJI (JP)
NAKAMURA SAKI (JP)
BEPPU SHOTARO (JP)
Application Number:
PCT/JP2021/006909
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
C08F14/18; C08F14/26; C08L27/12; H01B5/14; H01B13/00; H01L31/10; H01L51/50; H05B33/10; H05B33/22; H05B33/26
Domestic Patent References:
WO2008133088A12008-11-06
WO2005100420A12005-10-27
WO2009096342A12009-08-06
Foreign References:
JP2018126953A2018-08-16
JPH08239242A1996-09-17
JPH0925559A1997-01-28
JPH111593A1999-01-06
JP2009526351A2009-07-16
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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