Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLUOROPOLYMER COMPOSITION, MOLDED ARTICLE, AND INJECTION MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/130144
Kind Code:
A1
Abstract:
Provided is a fluoropolymer composition containing an electroconductive carbon compound and a copolymer that contains a tetrafluoroethylene unit and a fluoroalkyl vinyl ether unit, wherein the fluoroalkyl vinyl ether unit content is 5.0-8.0 mass% relative to the total monomer units constituting the copolymer, the volume resistivity of the fluoropolymer composition is 104-109 Ω·cm, and the melt flow rate of the fluoropolymer composition is 1-100 g/10 min.

More Like This:
JP3777118FLAME-RETARDANT RESIN COMPOSITION AND USE THEREOF
WO/2023/017811AQUEOUS DISPERSION AND METHOD FOR PRODUCING LAMINATE
JP5581204Fluoropolymer wire insulation object
Inventors:
IMAMURA HITOSHI (JP)
MUKAI ERI (JP)
Application Number:
PCT/JP2019/050181
Publication Date:
June 25, 2020
Filing Date:
December 20, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08L27/18; C08K3/04
Domestic Patent References:
WO2019017489A12019-01-24
Foreign References:
JPH0260954A1990-03-01
JP2003082187A2003-03-19
JP2002284883A2002-10-03
JP2015083666A2015-04-30
JPH061902A1994-01-11
JPS6137842A1986-02-22
JP2005133002A2005-05-26
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DENTAL ADHESIVE COMPOSITION

Next Patent: AGENT FOR IMPROVING HEAT RESISTANCE OR SALT TOLERANCE OF PLANTS