Title:
FOIL TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2022/050395
Kind Code:
A1
Abstract:
The present invention provides a foil transfer method in which transferred to a transfer target surface W11 of a transfer target object W1 is thermal transfer foil W2 comprising a foil layer W22 that includes foil and an adhesive layer W23 that is laminated to the foil layer W22. The foil transfer method comprises a placement step S1 and a foil transfer step S2. In the placement step S1, the thermal transfer foil W2 is placed on a support surface 16 of a support 15 so that the adhesive layer W23 faces upward, and the transfer target object W1 is placed on the thermal transfer foil W2 so that the transfer target surface W11 faces downward. In the foil transfer step S2, while the transfer target object W1 is pressed by a pressing body 71, the transfer target object W1 and the thermal transfer foil W2 are irradiated with laser light from above the transfer target object W1, such that the foil layer W22 of the thermal transfer foil W2 is transferred to the transfer target object W1.
Inventors:
KUNO TSUTOMU (JP)
Application Number:
PCT/JP2021/032530
Publication Date:
March 10, 2022
Filing Date:
September 03, 2021
Export Citation:
Assignee:
DGSHAPE CORP (JP)
International Classes:
B23K26/00; B41M3/12; B41M5/42; B41M5/46; B44C1/17
Foreign References:
| JPH06191064A | 1994-07-12 | |||
| JP2019010802A | 2019-01-24 | |||
| JP2020059208A | 2020-04-16 | |||
| JP2001270253A | 2001-10-02 | |||
| US20040108047A1 | 2004-06-10 | |||
| JPH0640070A | 1994-02-15 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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