Title:
FOLLOW-UP REVERSE-BULGING DRAWING FORMING APPARATUS AND METHOD FOR LARGE-SIZE THIN-WALL CURVED-SURFACE MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/142292
Kind Code:
A1
Abstract:
An ultralow temperature forming apparatus for a large-size thin-wall curved-surface member, comprising a forming die (1), a jacking unit (2), and a power unit (3). The forming die comprises an upper die (11), a lower die (12), and a blank holder (13); the upper die and the blank holder are connected to a press machine; the blank holder is provided above the lower die; a blank to be formed is placed between the lower die and the blank holder; and the jacking unit is located inside the lower die, and the jacking unit moves along the moving direction of the upper die to enable said blank to have a reverse-bulging deformation. The present invention further provides a follow-up reverse-bulging drawing forming method for the large-size thin-wall curved-surface member. Thus, wrinkling and cracking defects in a drawing forming process can be effectively suppressed, forming load is low, and the apparatus is simple and is convenient to manufacture.
Inventors:
YUAN SHIJIAN (CN)
LIU WEI (CN)
LIU WEI (CN)
Application Number:
PCT/CN2021/108086
Publication Date:
July 07, 2022
Filing Date:
July 23, 2021
Export Citation:
Assignee:
HARBIN INST TECHNOLOGY (CN)
International Classes:
B21D22/20; B21D22/22; B21D37/10; B21D37/16; B21D51/44
Domestic Patent References:
| WO2008025387A1 | 2008-03-06 |
Foreign References:
| CN112845787A | 2021-05-28 | |||
| CN112139339A | 2020-12-29 | |||
| CN107745029A | 2018-03-02 | |||
| CN110328278A | 2019-10-15 | |||
| CN104942112A | 2015-09-30 | |||
| CN105537362A | 2016-05-04 | |||
| JPH1043819A | 1998-02-17 |
Attorney, Agent or Firm:
TALENT PATENT & TRADEMARK FIRM (CN)
Download PDF:
Previous Patent: VIBRATION SENSOR
Next Patent: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
Next Patent: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE