Title:
FORCE SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/163195
Kind Code:
A1
Abstract:
A force sensor module according to an embodiment of the present invention is provided with a plurality of force sensors. Each of the force sensors has a plurality of sensor parts having mutually different force detection directions, and a flexible rubber member provided so as to cover the plurality of sensor parts. The rubber member is configured so as to transmit a force inputted from the outside to the plurality of force sensors by deforming in accordance with the force.
Inventors:
KATSUHARA TOMOKO (JP)
MIYASHITA HIDETOSHI (JP)
KAMADA RUI (JP)
MIYAZAWA KIYOKAZU (JP)
TSUBOI TOSHIMITSU (JP)
HASEGAWA HAYATO (JP)
MIYASHITA HIDETOSHI (JP)
KAMADA RUI (JP)
MIYAZAWA KIYOKAZU (JP)
TSUBOI TOSHIMITSU (JP)
HASEGAWA HAYATO (JP)
Application Number:
PCT/JP2021/046628
Publication Date:
August 04, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
G01L5/00; G01L5/162
Foreign References:
| JP2011085435A | 2011-04-28 | |||
| JP2001004656A | 2001-01-12 | |||
| JP2013036759A | 2013-02-21 | |||
| JP2009266898A | 2009-11-12 | |||
| JPS6461626A | 1989-03-08 | |||
| JPH0868704A | 1996-03-12 | |||
| JPS549384A | 1979-01-24 | |||
| JP2009534720A | 2009-09-24 | |||
| US20110290037A1 | 2011-12-01 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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