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Patent Searching and Data


Title:
GAP MOLD-MAKING METHOD, SHIM MANUFACTURING METHOD, MOLD-MAKING KIT MANUFACTURING METHOD, AND MOLD-MAKING KIT
Document Type and Number:
WIPO Patent Application WO/2020/153082
Kind Code:
A1
Abstract:
Provided is a method for making a mold of a gap between components, the method comprising: a step (S1) for preparing a curable composition M by mixing a resin material with a curing agent that promotes curing of the resin material; a step (S3) for cooling the curable composition (M) to a predetermined temperature at which curing of the curable composition (M) is not initiated, so as to manufacture a mold-making kit (K); a step (S4) for placing the mold-making kit (K) in a gap (G) between a first member (100) and a second member (120) so as to fill the gap (G); a step (S5) for curing the mold-making kit (K) between the first member (100) and the second member (120) to mold the mold-making kit (K) into the shape of the gap (G); and a step (S6) for removing the cured mold-making kit (K) from the gap (G).

Inventors:
KOBAYASHI YUSUKE (JP)
HAYASHI NORIYA (JP)
Application Number:
PCT/JP2019/050534
Publication Date:
July 30, 2020
Filing Date:
December 24, 2019
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C43/52; B29C33/40; B29C43/18; B29C59/00
Foreign References:
JPH07326510A1995-12-12
JPH07314582A1995-12-05
JPH06182772A1994-07-05
JP2009083200A2009-04-23
JP2013101990A2013-05-23
JP2010005971A2010-01-14
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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