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Title:
A GEMSTONE POLISHING ROBOT
Document Type and Number:
WIPO Patent Application WO/2020/161638
Kind Code:
A1
Abstract:
Aspects of the present disclosure provide a gemstone polishing robot and a method of polishing gemstone using the gemstone polishing robot. In an embodiment, the robot comprises: a balk (1) supported on a base (3); a head (5) coupled with the balk (1) through a guide (6) and a drive (7) such that the head (5) is vertically displaceable relative to the balk (1); a gemstone holding unit (25) coupled with the head (5) and configured to support a gemstone in contact with an abrasive surface (21) in a desired orientation; an encoder (30) configured to detect a depth of polishing of the gemstone in each of said one or a plurality of polishing iterations; and a gemstone modelling unit, which when executed by one or more processors, estimates at least one gemstone parameter based on an initial model of the gemstone and the detected depth of polishing of the gemstone in each of said one or a plurality of polishing iterations.

Inventors:
SYTENKO IVAN NIKOLAYEVICH (RU)
Application Number:
PCT/IB2020/050917
Publication Date:
August 13, 2020
Filing Date:
February 05, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FREEDOM AUTOMATION SOLUTIONS LLP (IN)
International Classes:
B24B9/16
Foreign References:
JPH04129657A1992-04-30
US4517770A1985-05-21
US5816896A1998-10-06
IN650MU2005A
Attorney, Agent or Firm:
KHURANA & KHURANA, ADVOCATES & IP ATTORNEYS (IN)
Download PDF:
Claims:
We Claim:

1. A robot (100) for polishing a gemstone in one or a plurality of polishing iterations, the robot comprising:

a balk (1), which at one of its end is supported on a base (3);

a head (5) coupled with the balk (1) at its other end through a guide (6) and a drive (7) such that the head (5) is vertically displaceable relative to the balk (1);

a gemstone holding unit (25) coupled with the head (5), said gemstone holding unit (25) configured to support a gemstone in contact with an abrasive surface (21) in a desired orientation;

an encoder (30) communicatively coupled to any or a combination of the guide (6) and the drive (7), said encoder (30) being configured to detect a depth of polishing of the gemstone in each of said one or a plurality of polishing iterations; and

a gemstone modelling unit, which when executed by one or more processors, estimates at least one gemstone parameter based on an initial model of the gemstone and the detected depth of polishing of the gemstone in each of said one or a plurality of polishing iterations.

2. The robot as claimed in claim 1, wherein the balk (1) is displaceable relative to the base (3), and wherein the balk (1) is configured with a balk turn drive (4).

3. The robot as claimed in claim 1, wherein the initial model of the gemstone comprises any or a combination of: 2D model of the gemstone, 3D model of the gemstone, silhouette image of the gemstone, and initial gemstone parameters selected from the group comprising facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

4. The robot as claimed in claim 1 , wherein said encoder (30) is configured to detect the depth of polishing of the gemstone by calculating a vertical distance travelled by the head during one polishing iteration.

5. The robot as claimed in claim 1, wherein the robot further comprises a pressure sensor (8) operatively coupled with the head (5), said pressure sensor (8) being configured to detect the pressure exerted on the head (5).

6. The robot as claimed in claim 1, wherein said encoder (30) is configured to detect an event when the gemstone contacts the abrasive surface (21) at the start of the polishing iteration based on said detected pressure, and wherein the encoder (30) is further configured to measure an initial height (Hi) upon detection of the event, further wherein said encoder (30) is configured to measure the final height (Hf) at the end of the polishing iteration.

7. The robot as claimed in claim 1, wherein the gemstone holding unit (25) is coupled with the head (5) through first drive unit (27), said first drive unit comprising: a turn drive for selecting the direction of polishing (9); a turn drive for selecting the angle of polishing (10); and a spindle with a facet selection rotary drive (11).

8. The robot as claimed in claim 1, wherein the abrasive surface (21) comprises a scaife (22) centred along a rotational axis of a mandrel (23), and wherein the mandrel is coupled to a second drive unit (28) to confer motion thereto.

9. The robot as claimed in claim 1, wherein the robot further comprises a gemstone polishing unit, which when executed by one or more processors, compares the estimated at least one gemstone parameter with one or more pre -determined gemstone parameters, and generates a feedback signal based on said comparison.

10. The robot as claimed in claim 9, wherein the gemstone polishing unit, which when executed by one or more processors, controls operations of any or a combination of the first drive unit (27), the second drive unit (28), the drive (7), and the balk turn drive (4) based on said feedback signal.

11. The robot as claimed any of claims 1-10, wherein the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more pre -determined gemstone parameters are selected from the group comprising: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

12. A method for polishing a gemstone in one or a plurality of polishing iterations, the method comprising the steps of:

(a) holding the gemstone by a gemstone holding unit (25) in a desired orientation;

(b) taking an initial model of the gemstone;

(c) estimating, at one or more processors, a depth of polishing required for matching at least one gemstone parameter with one or more pre -determined gemstone parameters when polishing is effected in said desired orientation;

(d) generating, at the one or more processors, a first feedback signal based on said estimated depth of polishing; and

(e) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a first polishing iteration, based on said first feedback signal.

13. The method as claimed in claim 12, wherein the method further comprises the steps of: (f) detecting, by an encoder (30), a depth of polishing of the gemstone achieved in the first polishing iteration;

(g) estimating, at the one or more processors, at least one gemstone parameter based on the initial model of the gemstone and the detected depth of polishing of the gemstone achieved in the first polishing iteration;

(h) comparing, at the one or more processors, the estimated at least one gemstone parameter with the one or more pre-determined gemstone parameters;

(i) generating, at the one or more processors, a second feedback signal based on said comparison;

(j) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a second polishing iteration, based on said second feedback signal; and

(k) repeating the steps (f) through (j) until the at least one gemstone parameter matches with the one or more pre-determined gemstone parameters with desired accuracy.

14. The method as claimed in any of the claim 12 and claim 13, wherein the step of contacting the gemstone against the abrasive surface in said desired orientation comprises controlling operations of any or a combination of a first drive unit (27), a second drive unit (28), a drive (7), and a balk turn drive (4).

15. The method as claimed in any of the claims 12-14, wherein the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more predetermined gemstone parameters are selected from the group comprising: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

Description:
A GEMSTONE POLISHING ROBOT

TECHNICAL FIELD

[0001] The present disclosure generally relates to the field of gemstone polishing. Aspects of the present disclosure provide a gemstone polishing robot and method of polishing gemstone using the gemstone polishing robot.

BACKGROUND

[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.

[0003] Gemstones, such as diamonds or turquoise, need to be cut and polished for placement in jewellery. The most precious gemstone, the diamond, is a colourless mineral made of carbon crystallized in the isometric system as octahedrons, dodecahedrons, and cubes. Approximately two hundred and fifty tons of earth needs to be moved to produce a one carat polished diamond. It requires on average a 3.5 carat rough diamond to produce a 1 carat polished diamond.

[0004] The quality and value of faceted diamonds are often described in terms of the “Four C's” namely, carat weight, colour, clarity, and cut. Conventionally, the beauty and value of a diamond rests in the hands of the craftsman. One of the vital aspects of a diamond’s value is cut. The quality of the cut determines its brilliance. To obtain the maximum brilliance, the facets must be of the right size, have correct angles to each other, and their surfaces must be finely polished with irregularities not larger than a few nanometers. For diamond working purposes, the diamond is mounted on a dop held by a tang and it is levelled with respect to the working member. The diamond levelling procedure provides for the correct angles and right size of the facets. Accordingly, grinding and polishing are the most common diamond working operations. Generally, diamonds are polished mechanically on a turntable or scaife. A scaife is a heavy, cast iron, horizontally spinning wheel with a working surface impregnated with oil and diamond powder.

[0005] In processing diamonds or artificial gemstones, a diamond to be processed is generally fixed to a diamond holder and then pressed against a scaife with a certain force to form facets on the diamond. To form facets with different inclination angles with respect to a central axis of the diamond held by the holder, the diamond holder requires three types of motion modes with respect to the rotating polishing surface placed at a fixed position, namely, (i) an inclining motion mode, in which the angle of the central axis of the diamond holder is adjusted on a plane perpendicular to the polishing surface to adjust an inclination angle of a facet to be formed, (ii) a vertically feeding motion mode, in which the diamond holder holding the diamond is precisely fed vertically by an amount with respect to the polishing surface and (iii) an index motion mode, in which the diamond holder is rotated through a certain angle around the central axis to polish a facet that is close to a completely processed specific facet.

[0006] Till date, many apparatuses for polishing gemstones are constructed that can, at least partially, establish these three motion modes mechanically. However, such apparatus needs extensive human intervention in terms of requirement of manual adjustment and/or inspection of the angles, stability, vibrations and the like parameters, both before and during the operation, and hence, are far from the desired level of automation in the gemstone industry. This problem is further aggravated by the lack of precision due to assembly errors in the apparatus, mechanical deformation in use and the likes.

[0007] The conventional apparatus and methods works on the fixed parameter based polishing i.e. the apparatus is fed with the desired (pre -determined) gemstone parameters (such as desired table size, crown angle, crown depth, girdle diameter, pavilion angle, pavilion depth, number of facets and the likes) to be achieved as the end result, and instructed to achieve the desired parameters by effecting polishing of the mounted gemstone by rubbing against an abrasive surface such as rotating scaife. The conventional polishing apparatus effects polishing of the gemstone in one-go until the desired gemstone parameter(s) is/are achieved. Following this static polishing approach results, most often, if not always, either in the inadequate polishing or in the loss of weight of precious gemstone due to over-polishing of the mounted gemstone. This leads to huge economic losses. Further, conventional apparatus and methods rely extensively on mechanical elements such as contact rings for setting-up and achievement of the polishing parameters. FIG. 1 illustrates an exemplary arrangement showing a diamond held by a holder for polishing, wherein 102 indicates a diamond to be polished, 104 indicates a pot, 106 indicates a contact -ring and 108 indicates a holder. As illustrated in Fig. 1, conventionally, a contact ring is used for setting-up the polishing angle (shown as 110), wherein achievement of the desired angle, and in-tur polishing of the diamond, is highly dependent on the diamond being held accurately by the pot ( 104). Such conventional apparatus and methods continue to polish the gemstone until the pot or contact ring or holder touches the rotating scaife. Repeated contact of holder/pot/ring with the rotating scaife invariably leads to damage to the holder/pot/ring as well as to the scaife and hence, requires frequent replacement/repair/restoration.

[0008] These shortcomings, inter-alia, others make conventional apparatus and methods commercially non-viable. Loss of weight of the precious gemstone while polishing using conventional apparatus and methods (owing to instances of over-polishing and/or machine errors) lead to huge economic losses and hence, an apparatus and method that effects polishing of the gemstones with high accuracy and with least human intervention remained a long-felt need and a prominent technical problem in the state of art.

OBJECTS OF THE INVENTION

[0009] An object of the present disclosure is to overcome the disadvantages associated with the conventional gemstone polishing apparatus and method of polishing gemstones by use thereof.

[0010] Another object of the present disclosure is to provide an automatic gemstone polishing robot.

[0011] Another object of the present disclosure is to provide a gemstone polishing robot that does not require human intervention.

[0012] Another object of the present disclosure is to provide a gemstone polishing robot that has high level of accuracy and precision.

[0013] Another object of the present disclosure is to provide a method of polishing gemstones using a gemstone polishing robot that is less time consuming.

[0014] Another object of the present disclosure is to provide a method of polishing gemstones using a gemstone polishing robot that is easy to setup.

[0015] Another object of the present disclosure is to provide a method of polishing gemstones using a gemstone polishing robot that is cost-effective.

SUMMARY

[0016] The present disclosure generally relates to the field of gemstone polishing. Aspects of the present disclosure provide a gemstone polishing robot and method of polishing gemstone using the gemstone polishing robot.

[0017] An aspect of the present disclosure provides a robot for polishing a gemstone in one or a plurality of polishing iterations, the robot comprising: a balk (1), which at one of its end is supported on a base (3); a head (5) coupled with the balk (1) at its other end through a guide (6) and a drive (7) such that the head (5) is vertically displaceable relative to the balk (1); a gemstone holding unit (25) coupled with the head (5), said gemstone holding unit (25) configured to support a gemstone in contact with an abrasive surface (21) in a desired orientation; an encoder (30) communicati vely coupled to any or a combination of the guide (6) and the drive (7), said encoder (30) being configured to detect a depth of polishing of the gemstone in each of said one or a plurality of polishing iterations; and a gemstone modelling unit, which when executed by one or more processors, estimates at least one gemstone parameter based on an initial model of the gemstone and the detected depth of polishing of the gemstone in each of said one or a plurality of polishing iterations.

[0018] In an embodiment, the balk (1) is displaceable relative to the base (3). In an embodiment, the balk (1) is configured with a balk turn drive (4). In an embodiment, the initial model of the gemstone comprises any or a combination of: 2D model of the gemstone, 3D model of the gemstone, silhouette image of the gemstone, and initial gemstone parameters selected from the group comprising facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets. In an embodiment, said encoder (30) is configured to detect the depth of polishing of the gemstone by calculating a vertical distance travelled by the head during one po fishing iteration. In an embodiment, the robot further includes a pressure sensor (8) operatively- coupled with the head (5), said pressure sensor (8) being configured to detect the pressure exerted on the head (5). In an embodiment, said encoder (30) is configured to detect an event when the gemstone contacts the abrasive surface (21) at the start of the polishing iteration based on said detected pressure. In an embodiment, the encoder (30) is further configured to measure an initial height (H;) upon detection of the event. In an embodiment, said encoder (30) is further configured to measure the final height (H f ) at the end of the polishing iteration. In an embodiment, the gemstone holding unit (25) is coupled with the head (5) through first drive unit (27), said first drive unit (27) including: a turn drive for selecting the direction of polishing (9); a turn drive for selecting the angle of polishing (10); and a spindle with a facet selection rotary drive (11). In an embodiment, the abrasive surface (21) includes a scaife (22) centred along rotational axis of a mandrel (23). In an embodiment, the mandrel (23) is coupled to a second drive unit (28) to confer motion thereto. In an embodiment, the robot further includes a gemstone polishing unit, which when executed by one or more processors, compares the estimated at least one gemstone parameter with one or more pre -determined gemstone parameters, and generates a feedback signal based on said comparison. In an embodiment, the gemstone polishing unit, which when executed by one or more processors, controls operations of any or a combination of the first drive unit (27), the second drive unit (28), the drive (7), and the balk turn drive (4) based on said feedback signal. In an embodiment, the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more pre-determined gemstone parameters are selected from the group including: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

[0019] Another aspect of the present disclosure relates to a method for polishing a gemstone in one or a plurality of polishing iterations, the method comprising the steps of: (a) holding the gemstone by a gemstone holding unit (25) in a desired orientation; (b) taking an initial model of the gemstone; (c) estimating, at one or more processors, a depth of polishing required for matching at least one gemstone parameter with one or more pre-determined gemstone parameters when the polishing is effected in said desired orientation; (d) generating, at the one or more processors, a first feedback signal based on said estimated depth of polishing; and (e) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a first polishing iteration, based on said first feedback signal.

[0020] In an embodiment, the method further includes the steps of: (f) detecting, by an encoder (30), a depth of polishing of the gemstone achieved in the first polishing iteration; (g) estimating, at the one or more processors, at least one gemstone parameter based on the initial model of the gemstone and the detec ted depth of polishing of the gemstone achieved in the first polishing iteration; (h) comparing, at the one or more processors, the estimated at least one gemstone parameter with the one or more pre-determined gemstone parameters; (i) generating, at the one or more processors, a second feedback signal based on said comparison; (j) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a second polishing iteration, based on said second feedback signal; and (k) repeating the steps (f) through (j) until the at least one gemstone parameter matches with the one or more pre-determined gemstone parameters with desired accuracy. In an embodiment, the step of contacting the gemstone against the abrasive surface in said desired orientation comprises controlling operations of any or a combination of a first drive unit (27), a second drive unit (28), a drive (7), and a balk turn drive (4). In an embodiment, the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more predetermined gemstone parameters are selected from the group including: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

[0021] Various objects, features, aspects and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] FIG. 1 illustrates an exemplary view showing usage of a contact ring for settingup the polishing angle, as used conventionally.

[0024] FIG. 2 illustrates an exemplary diagram depicting various parts/components of a gemstone polishing robot, in accordance with an embodiment of the present disclosure.

[0025] FIG. 3 illustrates an exemplary model of the polished diamond showing plurality of facets.

[0026] FIG. 4A illustrates an exemplary simplified model of the semi-polished diamond showing diamond table before the polishing and diamond table to be achieved after polishing.

[0027] FIG. 4B illustrates an exemplary simplified model of the gemstone after completion of first polishing iteration.

[0028] FIG. 4C illustrates an exemplary simplified model of the gemstone after completion of the desired polishing.

[0029] FIG. 5 illustrates exemplary functional components 500 of the gemstone polishing robot, in accordance with an embodiment of the present disclosure.

[0030] FIG. 6A illustrates an exemplary flow chart 600 showing a method of polishing of a diamond (first polishing iteration), in accordance with an embodiment of the present disclosure.

[0031] FIG. 6B illustrates an exemplary flow chart 650 showing a method of polishing of a diamond (second or subsequent polishing iteration), in accordance with an embodiment of the present disclosure.

[0032] FIG. 7 illustrates an exemplary computer system 700 to implement the proposed gemstone polishing robot, in accordance with embodiments of the present disclosure.

DETAILED DESCRIPTION

[0033] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives felling within the spirit and scope of the present disclosure as defined by the appended claims.

[0034] Each of the appended claims defines a separate invention, which for infringement purposes is recognized as including equivalents to the various elements or limitations specified in the claims. Depending on the context, all references below to the“invention” may in some cases refer to certain specific embodiments only. In other cases it will be recognized that references to the“invention” will refer to subject matter recited in one or more, but not necessarily all, of the claims.

[0035] As used in the description herein and throughout the claims that follow, the meaning of“a, an,” and“the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of“in” includes“in” and “on” unless the context clearly dictates otherwise.

[0036] All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g. “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.

[0037] Various terms as used herein are shown below. To the extent a term used in a claim is not defined below, it should be given the broadest definition persons in the pertinent art have given that term as reflected in printed publications and issued patents at the time of filing.

[0038] The term“gemstone” used herein throughout the present disclosure encompass, within its scope, natural as well as synthetic diamonds and other precious and semi-precious stones, as known to or appreciated by a person skilled in the pertinent art.

[0039] The present disclosure generally relates to the field of gemstone polishing. Aspects of the present disclosure provide a gemstone polishing robot and method of polishing gemstone using the gemstone polishing robot.

[0040] An aspect of the present disclosure provides a robot for polishing a gemstone in one or a plurality of polishing iterations, the robot comprising: a balk ( 1), which at one of its end is supported on a base (3); a head (5) coupled with the balk (1) at its other end through a guide (6) and a drive (7) such that the head (5) is vertically displaceable relative to the balk (1); a gemstone holding unit (25) coupled with the head (5), said gemstone holding unit (25) configured to support a gemstone in contact with an abrasive surface (21 ) in a desired orientation; an encoder (30) communicatively coupled to any or a combination of the guide (6) and the drive (7), said encoder (30) being configured to detect a depth of polishing of the gemstone in each of said one or a plurality of polishing iterations; and a gemstone modelling unit, which when executed by one or more processors, estimates at least one gemstone parameter based on an initial model of the gemstone and the detected depth of polishing of the gemstone in each of said one or a plurality of polishing iterations.

[0041 ] FIG. 2 illustrates an exemplary diagram depicting various parts/components of the gemstone polishing robot, in accordance with an embodiment of the present disclosure. As can be seen from FIG. 2, the gemstone polishing robot includes: a balk (1), which at one of its end is supported on a base (3); a head (5) coupled with the balk (1) at its other end through a guide (6) and a drive (7) such that the head (5) is vertically displaceable relative to the balk (1); a gemstone holding unit (25) coupled with the head (5), said gemstone holding unit (25) configured to support a gemstone in contact with an abrasive surface (21) in a desired orientation; an encoder (30) communicatively coupled to any or a combination of the guide (6) and the drive (7), said encoder (30) being configured to detect a depth of polishing of the gemstone in each of said one or a plurality of polishing iterations; and a gemstone modelling unit (not shown), which when executed by one or more processors, estimates at least one gemstone parameter based on an initial model of the gemstone and the detected depth of polishing of the gemstone in each of said one or a plurality of polishing iterations.

[0042] In an embodiment, the balk (1) is displaceable relative to the base (3). In an embodiment, the balk (1) is configured with a balk turn drive (4). In an embodiment, the initial model of the gemstone comprises any or a combination of: 2D model of the gemstone, 3D model of the gemstone, silhouette image of the gemstone, and initial gemstone parameters selected from the group comprising facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets. In an embodiment, the encoder (30) is configured to detect the depth of polishing of the gemstone by calculating a vertical distance travelled by the head during one polishing iteration. In an embodiment, the robot further includes a pressure sensor (8) operatively coupled with the head (5), the pressure sensor (8) being configured to detect the pressure exerted on the head (5). In an embodiment, the encoder (30) is configured to detect an event when the gemstone contacts the abrasive surface (21) at the start of the polishing iteration based on the detected pressure. In an embodiment, the encoder (30) is further configured to measure an initial height (H i ) upon detection of the event. In an embodiment, the encoder (30) is further configured to measure the final height (H f ) at the end of the polishing iteration. In an embodiment, the gemstone holding unit (25) is coupled with the head (5) through first drive unit (27), the first drive unit (27) including: a turn drive for selecting the direction of polishing (9); a turn drive for selecting the angle of polishing (10); and a spindle with a facet selection rotary drive (11). In an embodiment, the abrasive surface (21) includes a scaife (22) centred along rotational axis of a mandrel (23). In an embodiment, the mandrel (23) is coupled to a second drive unit (28) to confer motion thereto. In an embodiment, the robot further includes a gemstone polishing unit, which when executed by one or more processors, compares the estimated at least one gemstone parameter with one or more pre -determined gemstone parameters, and generates a feedback signal based on the comparison. In an embodiment, the gemstone polishing unit, which when executed by one or more processors, controls operations of any or a combination of the first drive unit (27), the second drive unit (28), the drive (7), and the balk turn drive (4) based on the feedback signal. In an embodiment, the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more pre-detemiined gemstone parameters are selected from the group including: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

[0043] In an embodiment, the gemstone holding unit includes any of a chuck (12) and a clamp detachably coupled with a collet (13) in which the gemstone is positioned. In an embodiment, the gemstone holding unit can include jigs, fixtures and the like holding mechanisms, as known to or appreciated by a person skilled in the art, to serve its intended purpose as laid down in the embodiments of the present disclosure. In an implementation, the gemstone holding unit includes a chuck or clamp so as to secure a collet on which a gemstone to be polished is positioned.

[0044] The gemstone polishing robot includes a gemstone holding unit (25), an abrasive surface such as a rotating scaife and the likes (21), and driving unit(s) to bring the gemstone in desired orientation against the abrasive surface. A person skilled in the art would appreciate that any other device/component can also form part of the robot that can effect and/or aid in polishing of the gemstone without departing from the scope and spirit of the present disclosure. Further, it is to be appreciated that although, the components/devices such as gemstone holding unit, an abrasive surface (such as a scaife and the likes), and driving unit(s) are generally described herein as part of the gemstone polishing robot, the same can be so configured or arranged or operatively coupled such that the same, in effect, yields desired polishing of the gemstone.

[0045] In an embodiment, the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more pre-determined gemstone parameters are selected from the group including: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets, but not limited thereto.

[0046] In an embodiment, the base (3) is detachably coupled with a mandrel (23) with an abrasive surface (22) centered along its axis (e.g. a rotating scaife). In an embodiment, the scaife (22) is supported on a mandrel (23). In an embodiment, the mandrel is coupled to a second drive unit (28) to confer movement and/or motion thereto. In an embodiment, the base (3) includes a turn axis (2) vertically mounted thereon, and a balk ( 1) to cater to the angle and height alignment with respect to the abrasive surface (21). In an embodiment, the balk (1) is configured with a balk turn drive (4) to confer motion thereto relative to the base (3) and/or the abrasive surface (21). At one end of the balk (1), head (5) is mounted, which is capable of moving vertically with the help of a guide (6) and a drive (7). In an embodiment, the head is further coupled to a pressure sensor (8). In an embodiment, the head (5) is coupled with a gemstone holding unit (21) through a first drive unit (27). The first drive unit (27) may include any or a combination of a turn drive for selecting/changing the direction of polishing (9), a turn drive for selecting/changing the angle of the po fishing (10) and a spindle with a facet selection rotary drive (11 ). In an embodiment, operations of any or a combination of a turn drive for selecting/changing the direction of polishing (9), a turn drive for selecting/changing the angle of the polishing (10) and a spindle with a facet selection rotary drive (11) is controlled by the feedback signal.

[0047] In an embodiment, the second drive unit (28) provides two degree of motion to the mandrel (23) with the respect to the mandrel axis. In an embodiment, the second drive unit (28) provides an angular motion and an axial motion to the mandrel (23) with respect to the mandrel axis. The second drive unit can include any of the actuators including linear actuators and the likes, pneumatic or electric motors including stepper motor and the likes, as known to or appreciated by a person skilled in the art, to serve its intended purpose as laid down in the embodiments of the present disclosure, without departing from the scope and spirit of the present invention.

[0048] The gemstone modelling unit and/or the gemstone polishing unit can be configured in a server to which the apparatus/robot is operatively/communicatively coupled with, such that the one or more gemstone parameters can be processed/evaluated/estimated and compared with respect to any or a combination of pre-determined one or more gemstone parameters. These units can be a simple processor or a group of one or more processors that can also be configured within the apparatus/robot itself and be operatively coupled therewith so as to, in real-time, process the one or more gemstone parameters.

[0049] The gemstone polishing robot may be enclosed in a housing to preclude interference from stray light and/or to preclude loss of light emergent from the gemstone. The gemstone polishing robot may optionally also include at least one detector (such as, image capturing device like television camera) and at least one illumination unit (such as, one or more emitters like LEDs), and they can be configured at appropriate angles such that the one or more facets or the gemstone can be appropriately illuminated while the light emergent (reflected, refracted, scattered or otherwise transmitted) from the gemstone can be captured by tlie at least one detector. The at least one detector and the illumination unit may be configured in opposite directions. Alternatively, the at least one detector may be configured at right angle to the illumination unit. Alternatively, the at least one detector and the illumination unit are configured at a same side. The robot may also be configured with one or a plurality of light directing means. The one or a plurality of light directing means can include one or a plurality of beam splitters, lenses and/or reflective mirrors. The light directing means may be stationary or movable and/or rotatable, for example, the light directing means may be movable along any or a combination of x-axis, y-axis and z-axis. In an embodiment, the base (3) is detachably coupled with an illumination unit (14). The illumination unit ( 14) may be encased, at least in part, in a housing ( 15). In an embodiment, the illumination unit (14) includes a plurality of emitters such as LED, that can be independently controlled (e.g. switched-on and switched-off) so as to illuminate desired facets of the gemstone. The emitters may emit the light of different colors or shades. In an implementation, the illumination unit (14) includes plurality of emitters arranged in a hemispherical or dome shape such that the desired facet can be illuminated from suitable angle in relation to the position of the detector. In an implementation, housing (15) includes one or a plurality of light directing means and/or optical lens. In an implementation, the housing (15) with one or a plurality of light directing means and/or optical lens and at least one lighting unit (14) (alternatively and synonymously termed as“an illumination unit”) is detachably coupled to the balk (1) with the help of a guide (17) and a third drive unit (16) to confer longitudinal movement thereto. In an embodiment, at least one detector (29) is configured inside the housing (15) such that the illumination unit (14) can illuminate the gemstone, while the at least one detector (29) can capture/detect the light emergent from the gemstone. A person skilled in the art should appreciate that the illumination unit and the at least one detector can be suitably positioned/configured as part of the robot, relative to the gemstone. For example, the illumination unit can be configured at a suitable angle relative to the at least one detector such that one or a plurality of fleets of the gemstone under processing can be appropriately illuminated and/or whole of the gemstone can be illuminated, and the light emergent from the gemstone can be captured with desired accuracy. The illumination unit and the detector(s) can be positioned on the same side/face relative to the gemstone held by the gemstone holding unit. Alternatively, the illumination unit can be configured in parallel and in an opposite direction relative to the detector(s) such that the gemstone can be viewed form rear. In an embodiment, the illumination unit is configured to illuminate the gemstone from a suitable angle. In an implementation, the detectors) is/are configured to detect the light emergent from said gemstone from a suitable angle. In an implementation, multiple detectors are provided, for example, two detectors may be placed at an angle of 90 degrees such that one detector may view the facet from top and another detector may view the facet from a plane perpendicular to the surface of the facet.

[0050] In an implementation, a gemstone cleaning unit such as, but not limited to, a brush (18) is coupled to the housing (15) to afford cleaning of the diamond being polished. In an implementation, the brush (18) is coupled with a fourth drive unit (19) to confer motion/movement thereto. In an alternative implementation, the gemstone cleaning unit includes a combination of a brash and a gemstone cleaning material. However, any other gemstone cleaning unit can be utilized, as known to or appreciated by a person skilled in the art, to clean the gemstone under processing without departing from the scope and spirit of the present disclosure.

[0051 ] In an embodiment, the gemstone polishing robot is provided with a repository with a master price list or rappaport including a plurality of pre-determined gemstone parameters like table size, crown angle, crown depth, girdle diameter, pavilion angle, pavilion depth, number of facets, facet dimensions, size of facets and proportions of facets, but not limited thereto, stored therein. In an alternative embodiment, the gemstone polishing robot can be operatively coupled to a computing device with a master price list or rappaport including a plurality of pre-determined gemstone parameters (also interchangeably referred to as desired gemstone parameters herein) like table size, crown angle, crown depth, girdle diameter, pavilion angle, pavilion depth, number of facets, facet dimensions, size of facets and proportions of facets, but not limited thereto. In an alternative embodiment, the gemstone polishing robot can be provided with an input device to facilitate input of the pre-determined gemstone parameters like table size, crown angle, crown depth, girdle diameter, pavilion angle, pavilion depth, number of facets, size of facets, facet dimensions, proportions of facets, halves, angle of facet and mutual positioning of facets, but not limited thereto, by a user. In an alternative embodiment, the gemstone polishing robot can be provided with an input device to facilitate input of (i) the initial model of the gemstone to be polished such as image or model of the gemstone to be polished (i.e. rough or semi-polished gemstone) like 2D model(s), 3D model(s), silhouette image(s) etc. and (ii) desired cut project such as image or model of the polished gemstone like 2D model(s), 3D model(s), silhouette image(s) etc. that need to be produced from the rough or semi-polished gemstone using the gemstone polishing robot of the present disclosure. Alternatively, the gemstone polishing robot can be communicatively coupled with any of the commercially available planning devices/ software that afford input of desired cut project and initial model of the gemstone to be polished.

[0052] In an embodiment, the gemstone polishing robot affords analysis of the one or more gemstone parameters including table size, crown angle, crown depth, girdle diameter, pavilion angle, pavilion depth, number of facets, sizes of facets, proportions of facets, halves, angle of facet and mutual positioning of facets. In an embodiment, the gemstone polishing robot affords comparison of the analyzed/detected/estimated gemstone parameters with the pre-determined gemstone parameters provided to the gemstone polishing robot via any or a combination of: a repository, containing a master price list or rappaport including a plurality of pre-determined gemstone parameters, operatively coupled with the gemstone polishing robot; a computing device, containing a master price list or rappaport including a plurality of pre-determined gemstone parameters, operatively coupled with the gemstone polishing robot; an input device, operatively coupled with the gemstone polishing robot to facilitate the input of and/or entry of the pre-detemiined gemstone parameters by the user; and an input device to facilitate the input of and/or entry of the pre -designed cut project (image or model) by the user that need to be produced from the rough or semi-polished gemstone.

[0053] In an embodiment, the gemstone polishing robot is configured to polish the gemstone in a plurality of iterations. Preferably, in each iteration, the operation of the gemstone polishing is controlled by way of a feedback signal. In an embodiment, the gemstone polishing robot is capable of controlling the polishing and/or faceting of the rough or semi-polished gemstone based on the comparison of analyzed/detected/estimated gemstone parameters with that of the pre-determined gemstone parameters. Accordingly, the gemstone polishing robot of the present disclosure do not rely on the indirect methods of evaluation of parameters viz. by measuring the mutual arrangement of the mechanical parts of the cutting/polishing machine as is done in the conventional systems and methods utilizing them. Rather, the gemstone poli shing robot of the present disclosure performs estimation of the gemstone model/parameters by simulating, on the initial 3D gemstone model, a polishing operation in the desired orientation (in which the gemstone is held by the gemstone holding unit) for a particular depth.

[0054] FIG. 3 illustrates an exemplary model of a polished diamond showing plurality of facets. FIG. 4A illustrates an exemplary simplified model of the semi-polished diamond showing diamond table before the polishing (402) and diamond table to be achieved after polishing (402a, shown in dotted lines). In an exemplary embodiment, the initial model (such as, the one shown in FIG. 4A) and the final model (such as the one shown in FIG. 3) are input to the gemstone modelling unit. The gemstone modelling unit, based on the comparison of initial model and final model can estimate the depth of polishing d required to be achieved by the robot, when the gemstone is held in the desired orientation against the abrasive surface (in the instant case, diamond can be held with its table surface parallel to the abrasive surface), so as to achieve the desired diamond table. A person skilled in the art is expected to be acquiesced with the simulation algorithms/software and/or the underlying geometry based calculations so as to perform the calculation of depth of polishing d when the initial model/gemstone parameters, final model/gemstone parameters and the orientation in which the diamond is held are known and/or estimation of the model/gemstone parameters of the gemstone being polished when the initial model/gemstone parameters, actual depth of the polishing and the orientation in which the diamond is held are known, and the same are not described herein for the sake of simplicity.

[0055] Based on the estimated depth of polishing, the gemstone polishing unit generates a feedback signal such that operations of any or a combination of the first drive unit (27), the second drive unit (28), the drive (7), and the balk turn drive (4) can be controlled based on the feedback signal. For example, the feedback signal issues command to any or a combination of the balk turn drive (4), the first drive unit (27), the second drive unit (28) to bring the surface of the diamond table in parallel to the abrasive surface, and then issues a command to the drive (7) to vertically displace the head (5) such that the table surface comes in contact with the abrasive surface. As the diamond surface comes in contact with the abrasive surface, the pressure exerted onto the head (5) increases drastically. This large change in the pressure can be detected/flagged, by the encoder (30), as an event that the diamond has come in contact the abrasive surface (21). The relative height of the head (5) at a point when the diamond contacts the abrasive surface (21) is marked/detected/measured by the encoder (30) as an initial height (H i ). The encoder (30) then calculates the final height (H f ) by adding the estimated depth of polishing to the initial height (H i ), for example, the encoder (30) detected the contact of diamond with the abrasive surface when the head was at an initial height (H i ) of 5.000 mm and the estimated depth of polishing was 100 microns to achieve the desired diamond table, in which case the final height (H f ) of the head will be 5.001 mm. The robot then maintains a constant pressure onto the head such that the diamond is rubbed against the abrasive surface for effecting polishing of the diamond till the head vertically traverses 100 microns or reaches at a height of 5.001 mm (to effect polishing in a single iteration) .

[0056] Alternatively, to preclude instances of under-polishing and/or over-polishing, the polishing can be done in plurality of polishing phases/iterations, in which case, the polishing may be momentarily stopped (e.g. by moving the head vertically upwards) when the head traverses about 50% or about 60% or about 70% or about 80% of the distance required to be travelled for achieving the desired polishing. FIG. 4B illustrates an exemplary simplified model of the gemstone after completion of first polishing iteration. Alternatively, the first iteration can be marked as completed when the head traverses any other distance. The encoder (30) detects the depth of polishing of the gemstone achieved in the first polishing iteration. The encoder (30) may also detect the depth of polishing (d in ) of the gemstone required to achieve the desired polishing. The gemstone modelling unit, based on the initial model/gemstone parameter of the gemstone and the depth of polishing of the gemstone achieved in the first polishing iteration, estimates the at least one model/gemstone parameter.

[0057] The gemstone polishing unit then compares the estimated at least one gemstone parameter/model with the one or more pre -determined gemstone parameters/model and generates a second feedback signal based on the comparison. Based on the feedback signal, a command is issued to the drive (7) to effect polishing of the diamond (assuming the diamond is still held in the desired orientation and it only needs vertical displacement to bring it in contact with the abrasive surface) . The abovementioned steps are again repeated until the at least one gemstone parameter matches with the one or more pre-determined gemstone parameters with desired accuracy.

[0058] In alternative embodiments, one or more images of the diamond can be captured by one or more detectors (15), and based on the captured images the gemstone parameters can be determined. A person skilled in the art is expected to be acquiesced with the techniques for determination of gemstone parameters such as facet geometry/dimensions based on the captured images, as being done in the commercially available silhouette grading machines and reflect scanners. The estimated gemstone parameter(s), as estimated by the gemstone modelling unit, can then be compared with the gemstone parameters) detected based on the captured image. Based on the comparison, the model/gemstone parameters as as estimated by the gemstone modelling unit can be corrected. This step affords correction of the errors that may be introduced in estimation of the depth of polishing d required to achieve the desired polishing. Based on the corrected model/gemstone parameters, the gemstone modelling unit again calculates the required depth of polishing (d in ) to be achieved to get the polished diamond, and based thereon, the gemstone polishing unit generates a feedback signal. Based on the feedback signal, the operations of any or a combination of a first drive unit (27), a second drive unit (28), a drive (7), and a balk turn drive (4) are controlled to control the overall polishing maneuver/operation. These steps are repeated until the at least one gemstone parameter matches with the one or more pre-deteimined gemstone parameters with desired accuracy. FIG. 4C illustrates an exemplary simplified model of the gemstone after completion of the desired polishing i.e. when the at least one gemstone parameter matches with the one or more pre-determined gemstone parameters by 100%.

[0059] Accordingly, the processing of gemstone polishing robot of the present disclosure neither requires conventional mechanical elements such as contact rings for setting-up the polishing parameters, nor requires human intervention for controlling the polishing process, greatly enhancing the level of precision and accuracy. Further, the gemstone polishing robot of the present disclosure has at least 5 degrees of motion including shaping motion (to exert desired control over the choice of face, face angle and face height) and technological motion (such as oscillation, direction of grinding and the likes) that enables precise control over the polishing process of the gemstone.

[0060] In an embodiment, the gemstone is polished and/or faceted in accordance with the pre -designed cut project (image or 2D/3D model) in multiple iterations. In an embodiment, each of the sides/facets are worked upon one after another. In an embodiment, individual tiers of facets are applied one after another. In an embodiment, the facets are applied under the projected angles. In an embodiment, the points or lines of intersection of facets of the same level or facets of different levels can serve as the starting point for measuring the dimensions of the facets. For example, when cutting the top of a round gemstone, the size of the main facet can be defined as the height in the profile image of the stone from the side of the girdle or as the height on the front of the stone from the side of the site. In accordance with the proposed method, gemstone parameters can be measured/estimated and the same can be compared with the desired gemstone parameters and based on the comparison, the polishing operation can be dynamically controlled.

[0061] FIG. 5 illustrates exemplary functional components 500 of the gemstone polishing robot in accordance with an embodiment of the present disclosure.

[0062] In an embodiment, the robot may comprise one or more processor(s) 502. The one or more processors) 502 may be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, logic circuitries, and/or any devices that manipulate data based on operational instructions. Among other capabilities, the one or more processor(s) 502 are configured to fetch and execute computer-readable instructions stored in a memory 504 of the robot. The memory 504 may store one or more computer-readable instructions or routines, which may be fetched and executed to create or share the data units over a network service. The memory 504 may comprise any non-transitory storage device including, for example, volatile memory such as RAM, or non-volatile memory such as EPROM, flash memory, and the like.

[0063] The robot may also comprise an interface(s) 505. The interface(s) 505 may comprise a variety of interfaces, for example, interfaces for data input and output devices, referred to as I/O devices, storage devices, and the like. The interface(s) 505 may facilitate communication of the robot with various devices coupled thereto such as an input unit and an output unit. The interface(s) 505 may also provide a communication pathway for one or more components of the robot. Examples of such components include, but are not limited to, processing engine(s) 508 and database 510.

[0064] The processing engine(s) 508 may be implemented as a combination of hardware and programming (for example, programmable instructions) to implement one or more functionalities of the processing engine(s) 508. In examples described herein, such combinations of hardware and programming may be implemented in several different ways. For example, the programming for the processing engine(s) 508 may be processor-executable instructions stored on a non-transitory machine-readable storage medium and the hardware for the processing engine(s) 508 may comprise a processing resource (for example, one or more processors), to execute such in structions. In the present examples, the machine -readable storage medium may store instructions that, when executed by the processing resource, implement the processing engine(s) 508. In such examples, the robot may comprise the machine-readable storage medium storing the instructions and the processing resource to execute the instructions, or the machine -readable storage medium may be separate but accessible to the robot and the processing resource. In other examples, the processing engine(s) 508 may be implemented by electronic circuitry. The database 510 may comprise data that is either stored or generated as a result of functionalities implemented by any of the components of the processing engine(s) 508.

[0065] In an exemplary embodiment, the processing engine(s) 508 may comprise a gemstone modelling unit 512, a gemstone polishing unit 514, and other units(s) 515. It should be appreciated that units being described are only exemplary units and any other unit or subunit may be included as part of the robot. These units too may be merged or divided into super-units or sub-units as may be configured.

[0066] In an embodiment, the gemstone modelling unit 512 facilitates in comparing the at least one gemstone parameter (such as an initial model of gemstone) with the one or more pre-determined gemstone parameters (such as final model of the polished gemstone), and based on the comparison, facilitates estimation of a depth of polishing required for matching the at least one gemstone parameter with the one or more pre-determined gemstone parameters when the polishing is effected in said desired orientation. The gemstone modelling unit 512 also facilitates estimation of the at least one model/gemstone parameter based on the initial model/gemstone parameter of the gemstone and the depth of polishing of the gemstone achieved in a polishing iteration.

[0067] In an embodiment, the gemstone polishing unit 514 facilitates comparison of the estimated at least one gemstone parameter/model with the one or more pre-determined gemstone parameters/model and generation of a feedback signal based on the comparison. The gem stone polishing unit 514 also facilitates generation of a feedback signal based on the estimated depth of polishing. The feedback signals afford controlling operations of any or a combination of the first drive unit (27), the second drive unit (28), the drive (7), and the balk turn drive (4).

[0068] In accordance with other embodiments of the present disclosure, when the desired polishing is achieved by making use of one or more detectors (15) to capture one or more images of the gemstone/diamond, and determination of gemstone parameters based on the captured images, units such as gemstone evaluation unit (that aids in detection of one or more gemstone parameters based on the detection of the light emergent from sai d gemstone and/or based on the captured images) and image processing unit (that can compare the one or more gemstone parameters detected based on detection of the light emergent from said gemstone and/or based on the captured images with the one or more gemstone parameters estimated by the gemstone modelling unit, and corrects the one or more gemstone parameters estimated by the gemstone modelling unit) can also be implemented. Alternatively, the functionalities of the gemstone evaluation unit and the image processing unit can be merged into a single unit or can be combined or otherwise merged with the gemstone modelling unit 512 and/or the gemstone polishing unit 514.

[0069] In an exemplary embodiment, the gemstone evaluation unit facilitates detection of one or more gemstone parameters based on detection of the light emergent from said gemstone. The detected one or more gemstone parameters can be transmitted to the image processing unit 514. The image processing unit 514 facilitates comparison of the one or more detected gemstone parameters with one or a plurality of pre -determined gemstone parameters. The image processing unit 514 further facilitates in correcting the one or more gemstone parameters estimated by the gemstone modelling unit based on the comparison. The image processing unit 514 also facilitates in generation of a feedback signal and in transmission of the feedback signal for controlling the polishing of gemstone.

[0070] In an embodiment, the robot can be implemented using any or a combination of hardware components and software components such as a cloud, a server, a computing system, a computing device, a network device and the like. Further, the robot can interact with any of the entity devices through a website or an application that can reside in the entity devices In an implementation, the robot can be accessed by website or application that can be configured with any operating system, including but not limited to, AndroidTM, iOSTM, and the like. Examples of the computing devices can include, but are not limited to, a computing device associated with industrial equipment or an industrial equipment based asset, a smart camera, a smart phone, a portable computer, a personal digital assistant, a handheld device and the like.

[0071] In an embodiment, the robot can include one or more processors (interchangeably can be referred to as processors, herein) of control unit which can be communicatively coupled to a memory which can store one or more instructions to be executed by processors. In an embodiment, the robot may not be connected to the network at all and may be a standalone device which has alphanumeric character stored on the system itself. The robot 502 may be implemented on a mobile communication device.

[0072] Further, the network can be a wireless network, a wired network or a combination thereof that can be implemented as one of the different types of networks, such as Intranet, Local Area Network (LAN), Wide Area Network (WAN), Internet, and the like. Further, the network can either be a dedicated network or a shared network. The shared network can represent an association of the different types of networks that can use a variety of protocols, for example, Hypertext Transfer Protocol (HTTP), Transmission Control Protocol/Intemet

Protocol (TCP/IP), Wireless Application Protocol (WAP), and the like.

[0073] Another aspect of the present disclosure relates to a method for polishing a gemstone in one or a plurality of polishing iterations, the method comprising the steps of: (a) holding the gemstone by a gemstone holding unit (25) in a desired orientation; (b) taking an initial model of the gemstone; (c) estimating, at one or more processors, a depth of polishing required for matching at least one gemstone parameter with one or more pre -determined gemstone parameters when the polishing is effected in said desired orientation; (d) generating, at the one or more processors, a first feedback signal based on said estimated depth of polishing; and (e) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a first polishing iteration, based on said first feedback signal.

[0074] In an embodiment, the method further includes the steps of: (f) detecting, by an encoder (30), a depth of polishing of the gemstone achieved in the first polishing iteration; (g) estimating, at the one or more processors, at least one gemstone parameter based on the initial model of the gemstone and the detected depth of polishing of the gemstone achieved in the first polishing iteration; (h) comparing, at the one or more processors, the estimated at least one gemstone parameter with the one or more pre -determined gemstone parameters; (i) generating, at the one or more processors, a second feedback signal based on said comparison; (j) contacting the gemstone against the abrasive surface (21) in said desired orientation, in a second polishing iteration, based on said second feedback signal; and (k) repeating the steps (f) through (j) until the at least one gemstone parameter matches with the one or more pre-determined gemstone parameters with desired accuracy. In an embodiment, the step of contacting the gemstone against the abrasive surface in said desired orientation comprises controlling operations of any or a combination of a first drive unit (27), a second drive unit (28), a drive (7), and a balk turn drive (4). In an embodiment, the at least one gemstone parameter, the estimated at least one gemstone parameter, and the one or more predetermined gemstone parameters are selected from the group including: facet dimensions, crown angle, crown depth, table size, pavilion angle, pavilion depth, girdle diameter, number of facets and proportions of facets.

[0075] FIG. 6A illustrates a flow diagram 600 illustrating a method of polishing a gemstone (first polishing iteration) in accordance with an embodiment of the present disclosure. At block 602, the gemstone to be polished is held by a gemstone holding unit in a desired orientation. At block 604, an initial model of the gemstone is taken. At block 606, a depth of polishing required for matching at least one gemstone parameter with one or more pre -determined gemstone parameters when the polishing is effected in said desired orientation is estimated at one or more processors. At block 608, a first feedback signal based on the estimated depth of polishing is generated at the one or more processors. At block 610, the gemstone is contacted against the abrasive surface (21) in the desired orientation based on the first feedback signal.

[0076] FIG. 6B illustrates a flow diagram 650 illustrating a method of polishing a gemstone (second or subsequent polishing iteration(s), after the first polishing iteration) in accordance with an embodiment of the present disclosure. At block 652, a depth of polishing of the gemstone achieved in the first polishing iteration is detected by an encoder (30). At block 654, at least one gemstone parameter is estimated, at the one or more processors, based on the initial model of the gemstone and the detected depth of polishing of the gemstone achieved in the first polishing iteration. At block 656, the estimated at least one gemstone parameter is compared with the one or more pre-detennined gemstone parameters, at the one or more processors. At block 658, a feedback signal is generated, at one or more processors, based on said comparison. At block 660, the gemstone is contacted against the abrasive surface (21) in the desired orientation, in a polishing iteration, based on the feedback signal. The steps shown at blocks 652 to 660 may optionally be repeated until the at least one gemstone parameter matches with the one or more pre -determined gemstone parameters with desired accuracy. It should be appreciated that in case the polishing is repeated after second iteration, the reference made to the“first iteration” should be construed to be the“second iteration” and the like-wise in each of the steps shown at blocks 652 and 654, to effect desired polishing of the gemstone in plurality of polishing iterations.

[0077] FIG. 7 illustrates an exemplary computer system 700 to implement the proposed robot in accordance with embodiments of the present disclosure. As shown in FIG. 7, a computer system can include an external storage device 710, a bus 720, a main memory 730, a read only memory 740, a mass storage device 750, communication port 760, and a processor 770. A person skilled in the art will appreciate that computer system may include more than one processor and communication ports. Examples of processor 770 include, but are not limited to, an Intel® Itanium® or Itanium 2 processor(s), or AMD® Opteron® or Athlon MP® processor(s), Motorola® lines of processors, FortiSOC™ system on a chip processors or other future processors. Processor 770 may include various modules associated with embodiments of the present invention. Communication port 760 can be any of an RS- 232 port for use with a modem based dialup connection, a 10/100 Ethernet port, a Gigabit or 10 Gigabit port using copper or fiber, a serial port, a parallel port, or other existing or future ports. Communication port 760 may be chosen depending on a network, such a Local Area Network (LAN), Wide Area Network (WAN), or any network to which computer system connects.

[0078] Memory 730 can be Random Access Memory (RAM), or any other dynamic storage device commonly known in the art. Read only memory 740 can be any static storage device(s) e.g., but not limited to, a Programmable Read Only Memory (PROM) chips for storing static information e.g., start-up or BIOS instructions for processor 770. Mass storage 750 may be any current or future mass storage solution, which can be used to store information and/or instructions. Exemplary mass storage solutions include, but are not limited to. Parallel Advanced Technology Attachment (PATA) or Serial Advanced Technology Attachment (SATA) hard disk drives or solid-state drives (interal or external, e.g., having Universal Serial Bus (USB) and/or Firewire interfaces), e.g. those available from Seagate (e.g., the Seagate Barracuda 7102 family) or Hitachi (e.g., the Hitachi Deskstar 7K1000), one or more optical discs, Redundant Array of Independent Disks (RAID) storage, e.g. an array of disks (e.g., SATA arrays), available from various vendors including Dot Hill Systems Corp., LaCie, Nexsan Technologies, Inc. and Enhance Technology, Inc.

[0079] Bus 720 communicatively couples processor(s) 770 with the other memory, storage and communication blocks. Bus 720 can be, e.g. a Peripheral Component Interconnect (PCI) / PCI Extended (PCI-X) bus, Small Computer System Interface (SCSI), USB or the like, for connecting expansion cards, drives and other subsystems as well as other buses, such a front side bus (FSB), which connects processor 770 to software system.

[0080] Optionally, operator and administrative interfaces, e.g. a display, keyboard, and a cursor control device, may also be coupled to bus 720 to support direct operator interactionwith computer system. Other operator and administrative interfaces can be provided through network connections connected through communication port 760. External storage device 710 can be any kind of external hard-drives, floppy drives, IOMEGA® Zip Drives, Compact Disc - Read Only Memory (CD-ROM), Compact Disc - Re-Writable (CD-RW), Digital Video Disk - Read Only Memory (DVD-ROM). Components described above are meant only to exemplify various possibilities. In no way should the aforementioned exemplary computer system limit the scope of the present disclosure.

[0081] Embodiments of the present disclosure may be implemented entirely hardware, entirely software (including firmware, resident soflware, micro-code, etc.) or combining software and hardware implementation that may all generally be referred to herein as a “circuit,” “module,” “component,” or “system.” Furthermore, aspects of the present disclosure may take the form of a computer program product comprising one or more computer readable media having computer readable program code embodied thereon.

[0082] Thus, it will be appreciated by those of ordinary skill in the art that the diagrams, schematics, illustrations, and the like represent conceptual views or processes illustrating systems and methods embodying this invention. The functions of the various elements shown in the figures may be provided through the use of dedicated hardware as well as hardware capable of executing associated software. Similarly, any switches shown in the figures are conceptual only. Their function may be carried out through the operation of program logic, through dedicated logic, through the interaction of program control and dedicated logic, or even manually, the particular technique being selectable by the entity implementing this invention. Those of ordinary skill in the art further understand that the exemplary hardware, software, processes, methods, and/or operating systems described herein are for illustrative purposes and, thus, are not intended to be limited to any particular named.

[0083] As used herein, and unless the context dictates otherwise, the tenn "coupled to" is intended to include both direct coupling (in which two elements that are coupled to each other contact each other) and indirect coupling (in which at least one additional element is located between the two elements). Therefore, the tenns "coupled to" and "coupled with" are used synonymously. Within the context of this document terms "coupled to" and "coupled with" are also used euphemistically to mean “communicatively coupled with” over a network, where two or more devices are able to exchange data with each other over the network, possibly via one or more intermediary device.

[0084] It should be apparent to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the tenns“comprises” and“comprising” should be interpreted as referring to elements, components, or steps in a non-exclusive maimer, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. Where the specification claims refers to at least one of something selected from the group consisting of A, B, C and N, the text should be interpreted as requiring only one element from the group, not A plus N, or B plus N, etc. [0085] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.

ADVANTAGES OF THE INVENTION

[0086] The present disclosure provides a gemstone polishing robot that overcomes the disadvantages associated with the conventional gemstone polishing apparatus.

[0087] The present disclosure provides a gemstone polishing robot.

[0088] The present disclosure provides a gemstone polishing robot that does not require human intervention.

[0089] The present disclosure provides a gemstone polishing robot that has high level of accuracy and precision.

[0090] The present disclosure provides a method of polishing gemstones using a gemstone polishing robot that is less time consuming.

[0091] The present disclosure provides a method of polishing gemstones using a gemstone polishing robot that is easy to setup.

[0092] The present disclosure provides a method of polishing gemstones using a gemstone polishing robot that is cost-effective.