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Patent Searching and Data


Title:
GRINDING COMPOSITION, PRODUCTION METHOD FOR GRINDING COMPOSITION, GRINDING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/181419
Kind Code:
A1
Abstract:
The present invention provides a means capable of, when grinding an object to be ground containing (a) a material having a silicon-nitrogen bond and (b) another material, improving the ratio of the grinding rate of the material (a) with respect to the grinding rate of the material (b). This grinding composition is for use in grinding the to-be-ground object containing (a) the material having a silicon-nitrogen bond and (b) the other material, wherein the grinding composition contains an organic acid-immobilized silica, a dispersion medium, a selectivity improver for improving the ratio of the grinding rate of the material (a) with respect to the grinding rate of the material (b), and an acid. The selectivity improver is an organopolysiloxane having a hydrophilic group.

Inventors:
YOSHIZAKI YUKINOBU (JP)
TAKAHASHI YOHEI (JP)
NAKATA YOHEI (JP)
Application Number:
PCT/JP2019/007850
Publication Date:
September 26, 2019
Filing Date:
February 28, 2019
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
JP2016025156A2016-02-08
JP2000144111A2000-05-26
JP2018085513A2018-05-31
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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