Title:
GRINDING DEVICE, GRINDING METHOD AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/013037
Kind Code:
A1
Abstract:
This grinding device for grinding a substrate comprises substrate holding units which hold the substrate, and annular grinding units which contact at least the center and the periphery of the substrate held by the substrate holding units and grind said substrate, wherein a plurality of the substrate holding units and of the grinding units are provided, and the diameter of at least one of the plurality of grinding units is different from the diameter of the other grinding units.
Inventors:
TAMURA TAKESHI (JP)
KODAMA MUNEHISA (JP)
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2018/025158
Publication Date:
January 17, 2019
Filing Date:
July 03, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B24B7/04; B24B49/12
Foreign References:
| JP2001322056A | 2001-11-20 | |||
| JPH0758068A | 1995-03-03 | |||
| JP2008155292A | 2008-07-10 | |||
| JP2015019053A | 2015-01-29 | |||
| JP2014042959A | 2014-03-13 | |||
| JP2014037045A | 2014-02-27 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: