Title:
GRINDING PLATE AND GRINDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/008612
Kind Code:
A1
Abstract:
Teaching (teach-in) work is performed, and from said teach-in position (SX), the workpiece (2) is ground by only a prescribed "trial grinding amount (A)." Subsequently, the diameter of the workpiece is measured. Based on the results of the measurement, the residual amount to be ground so that the workpiece has the finished dimensions (residual grinding amount) is calculated and grinding by only said "residual grinding amount (R)" is performed.
Inventors:
NISHIDE KOUJI
NAKANO SUSUMU
ISHIKAWA YOSHIAKI
SAKAMOTO TSUBASA
NAKANO SUSUMU
ISHIKAWA YOSHIAKI
SAKAMOTO TSUBASA
Application Number:
PCT/JP2012/066079
Publication Date:
January 17, 2013
Filing Date:
June 22, 2012
Export Citation:
Assignee:
NSK LTD (JP)
NISHIDE KOUJI
NAKANO SUSUMU
ISHIKAWA YOSHIAKI
SAKAMOTO TSUBASA
NISHIDE KOUJI
NAKANO SUSUMU
ISHIKAWA YOSHIAKI
SAKAMOTO TSUBASA
International Classes:
B24B49/02; B23Q15/24; B24B5/00; B24B19/06
Foreign References:
| JPH0329257U | 1991-03-22 | |||
| JPH04300160A | 1992-10-23 | |||
| JP2011045940A | 2011-03-10 | |||
| JP2008084130A | 2008-04-10 | |||
| JP2003094303A | 2003-04-03 | |||
| JP2010076005A | 2010-04-08 |
Other References:
See also references of EP 2732918A4
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims: