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Patent Searching and Data


Title:
GROUND REFERENCE SHAPE FOR HIGH SPEED INTERCONNECT
Document Type and Number:
WIPO Patent Application WO/2021/232510
Kind Code:
A1
Abstract:
Apparatus and methods are provided for providing provide high-speed interconnect using bond wires. According to various aspects of the subject innovation, the provided techniques may provide a ground shape to shield a high-speed signal wire from the substrate in a semiconductor assembly. In an exemplary embodiment, there is provided an assembly that may comprise a substrate, a semiconductor die attached to the substrate, a signal bond wire connecting a bond pad on the semiconductor die and a bond finger on the substrate, and a ground shape on the substrate to shield the signal wire from the substrate.

Inventors:
LIOU, Shiann-Ming (No. 1 Lane 500 Shengxia Road,China Pilot Free Trade Zone, Pudong New Area, Shanghai 0, CN)
ZHAO, Gang (No. 1 Lane 500 Shengxia Road,China Pilot Free Trade Zone, Pudong New Area, Shanghai 0, CN)
Application Number:
PCT/CN2020/095184
Publication Date:
November 25, 2021
Filing Date:
June 09, 2020
Export Citation:
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Assignee:
INNOGRIT TECHNOLOGIES CO., LTD. (No. 1 Lane 500 Shengxia Road,China Pilot Free Trade Zone, Pudong New Area, Shanghai 0, CN)
International Classes:
H01L23/522; H01L21/768
Attorney, Agent or Firm:
XU & PARTNERS, LLC. (Building No. 1 Universal High-Tech Plaza,958 Zhen Bei Road, Putuo District, Shanghai 3, CN)
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