Title:
GUIDE WIRE SHAPING MOLD AND METHOD FOR SHAPING GUIDE WIRE
Document Type and Number:
WIPO Patent Application WO/2021/015103
Kind Code:
A1
Abstract:
Provided are: a guide wire shaping mold that folds back the distal end of a guide wire to reduce damage to blood vessels and does not require any heating treatment; and a method for shaping a guide wire using the guide wire shaping mold. This guide wire shaping mold is configured to shape a guide wire having a ring-shaped distal end so as to have a reduced ring diameter and is characterized by being provided with: a wire shaping part configured such that the ring-shaped portion of the guide wire is located thereon; and a wire withdrawal path that is formed in a path shape, communicates with the wire shaping part, and is configured such that the guide wire is withdrawn in a linear direction from the proximal end.
Inventors:
ISHIBASHI YUKI (JP)
AKASHI YOSHIHIRO (JP)
YAMASAKI HARUHIKO (JP)
MITSUHASHI KATSUNORI (JP)
MORISHITA YOSHIRO (JP)
AKASHI YOSHIHIRO (JP)
YAMASAKI HARUHIKO (JP)
MITSUHASHI KATSUNORI (JP)
MORISHITA YOSHIRO (JP)
Application Number:
PCT/JP2020/027748
Publication Date:
January 28, 2021
Filing Date:
July 17, 2020
Export Citation:
Assignee:
UNIV SCHOOL ST MARIANNA MEDICINE (JP)
OZK CO LTD (JP)
SHINWA SYOJI CO LTD (JP)
OZK CO LTD (JP)
SHINWA SYOJI CO LTD (JP)
International Classes:
A61M25/09; B21F1/00
Foreign References:
| JP2006334321A | 2006-12-14 | |||
| JPH04108555U | 1992-09-18 | |||
| JPH02151328A | 1990-06-11 | |||
| JPH08132164A | 1996-05-28 | |||
| US1578462A | 1926-03-30 |
Attorney, Agent or Firm:
TAKATSU Toshikazu (JP)
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