Title:
HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/107066
Kind Code:
A1
Abstract:
The present invention relates to a halogen-free thermosetting resin composition, and a prepreg and a printed circuit laminate using the same. Based on 100 parts by weight of an organic solid matter, the halogen-free thermosetting resin composition comprises: (A) 30 to 60 parts of halogen-free epoxy resin, (B) a first curing agent: 5 to 30 parts of phosphorus-containing bisphenol, (C) a second curing agent: 5 to 30 parts of dicyclopentadiene phenolic aldehyde, and (D) a phosphorus-containing flame retardant. The prepreg and the printed circuit laminate manufactured by using the halogen-free thermosetting resin composition provided in the present invention have a high glass transition temperature, excellent dielectric performance, a low water absorption, good thermal resistance and good processability, and can provide halogen-free flame retardance up to UL94V-0.
Inventors:
YOU JIANG (CN)
HUANG TIANHUI (CN)
YANG ZHONGQIANG (CN)
HUANG TIANHUI (CN)
YANG ZHONGQIANG (CN)
Application Number:
PCT/CN2015/080538
Publication Date:
July 07, 2016
Filing Date:
June 01, 2015
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/092; B32B27/04; C08G59/40; C08K3/36; C08K5/5333; C08L85/02; H05K1/03
Foreign References:
| CN103756257A | 2014-04-30 | |||
| CN1795223A | 2006-06-28 | |||
| CN1723243A | 2006-01-18 | |||
| CN101195676A | 2008-06-11 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
北京品源专利代理有限公司 (CN)
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