Title:
HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/152602
Kind Code:
A1
Abstract:
Provided are a halogen-free thermosetting resin composition, and a prepreg and laminate for printed circuits using same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids: (A) 5-50 parts of a cyanate resin; (B) 5-40 parts of a polyphenyl ether resin; (C) 5-30 parts of a phosphorus-containing bisphenol polymer; and (D) 30-60 parts of a halogen-free epoxy resin. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition provided have a high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance, high peel strength, excellent heat and humidity resistance and good processability, and can achieve halogen-free flame retardancy and reach the UL94 V-0 grade.
Inventors:
LUO CHENG (CN)
TANG GUOFANG (CN)
TANG GUOFANG (CN)
Application Number:
PCT/CN2016/098450
Publication Date:
September 14, 2017
Filing Date:
September 08, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; C08G59/40; C08L85/02
Foreign References:
| CN102181143A | 2011-09-14 | |||
| CN102020830A | 2011-04-20 | |||
| CN102585480A | 2012-07-18 | |||
| CN104371321A | 2015-02-25 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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