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Title:
HARD COATING AND CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2017/179233
Kind Code:
A1
Abstract:
A hard coating that is formed on a substrate, wherein the hard coating comprises a bilayer structure layer made by laminating, in order from the substrate side, a lower layer and an upper layer. When the lower surface of the lower layer that is located on the substrate side of the bilayer structure layer and configures the lower end face is a first interface, the interface between the upper surface of the lower layer and the lower surface of the upper layer is a second interface, the upper surface of the upper layer that configures the upper end face opposite to the lower end face of the bilayer structure layer is a third interface, and a cross-section of the bilayer structure layer that is parallel to the thickness direction thereof is viewed, the average grain diameter G1 of crystal grains at a distance of 100 nm from the first interface toward the second interface, the average grain diameter G2 of crystal grains at a distance of 100 nm from the second interface toward the first interface, the average grain diameter G3 of crystal grains at a distance of 100 nm from the second interface toward the third interface, and the average grain diameter G4 of crystal grains at the third interface satisfy the relational expression G2>G3>G4>G1.

Inventors:
ARUMSKOG PAER CHRISTOFFER (JP)
UTSUMI YOSHIHARU (JP)
TSUDA KEIICHI (JP)
TANAKA KEIZO (JP)
SETOYAMA MAKOTO (JP)
Application Number:
PCT/JP2016/083385
Publication Date:
October 19, 2017
Filing Date:
November 10, 2016
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
C23C14/06; B23B27/14; B23B51/00
Domestic Patent References:
WO2016042072A12016-03-24
WO2010050374A12010-05-06
WO2007111301A12007-10-04
Foreign References:
JP2013527807A2013-07-04
JPH10109206A1998-04-28
JP2007015106A2007-01-25
JP2015160259A2015-09-07
JP2011067883A2011-04-07
JP2013223894A2013-10-31
JP2009079266A2009-04-16
JP2012092433A2012-05-17
JP2005022071A2005-01-27
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
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