HARNESS FOR ELECTRONIC DEVICE WIRING AND ELECTRONIC DEVICE

WIPO Patent Application WO/2010/092803

A1

Disclosed is a harness for electronic device wiring for which a portion wherein electrical wires are bundled to be aligned with each other and are covered by a jacket forms a flat cable part that is wrapped around the perimeter of a rotary shaft so that the direction of alignment of the wires is perpendicular to an overlaid housing surface, and a portion which continues from the flat cable part and for which each of the aforementioned electrical wires is exposed forms a jacket strip part that is more distant from the aforementioned rotary shaft than is the aforementioned flat cable part.

NAKAZAKI SHIGERU (JP)
SHINOHARA TOMOYUKI (JP)

PCT/JP2010/000803

August 19, 2010

February 09, 2010

Click for automatic bibliography generation  

FUJIKURA LTD (JP)
NAKAZAKI SHIGERU (JP)
SHINOHARA TOMOYUKI (JP)

H01B7/04; H01B7/00; H01B7/08; H02G11/00; H04M1/02; H01B11/20

WO2007136040A1	2007-11-29
WO2009063919A1	2009-05-22

JP2008257969A	2008-10-23
JP2008263264A	2008-10-30
JP2008257970A	2008-10-23
JP2003046275A	2003-02-14
JPH04233298A	1992-08-21
JP2007036515A	2007-02-08
JP2008210583A	2008-09-11
JP2007311934A	2007-11-29
JP2000138522A	2000-05-16
JP2004040524A	2004-02-05
JP2009030097A	2009-02-12
JP2007036515A	2007-02-08

TAKASHI MATSUKAWA ET AL.: "Slide-gata Keitai Denwa Muke Gokuboso Dojiku Cable Assembly", FUJIKURA TECHNICAL JOURNAL, 2008, pages 21 - 26, XP008153484
See also references of EP 2383753A4

SHIGA, Masatake et al. (JP)
Masatake Shiga (JP)

View/Download PDF      PDF Help

Previous Patent: CENTRIFUGAL FAN

Next Patent: SEMICONDUCTOR PROTECTION FILM-FORMING FILM WITH DICING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR...