Title:
HEAT CONDUCTIVE MATERIAL FORMING COMPOSITION, HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE MULTILAYER SHEET, AND DEVICE HAVING HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/166541
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a composition for forming a heat conductive material having excellent heat conductivity. Also, the present invention addresses the problem of providing a heat conductive sheet, a heat conductive multilayer sheet, and a device having a heat conductive sheet, which are formed of said composition. A heat conductive material forming composition according to the present invention contains inorganic particles and a compound represented by general formula (1).
Inventors:
HAYASHI DAISUKE (JP)
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
OZAWA SHIN (JP)
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
OZAWA SHIN (JP)
Application Number:
PCT/JP2021/002045
Publication Date:
August 26, 2021
Filing Date:
January 21, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/18; C08G59/20; C08G59/40; C08G59/62; C08K3/00; C08K3/28; C08K3/38; C08L63/00; C08L101/02; C09K5/14; H01L23/36; H01L23/373
Domestic Patent References:
| WO2018147425A1 | 2018-08-16 |
Foreign References:
| JP2013143243A | 2013-07-22 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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