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Patent Searching and Data


Title:
HEAT DISSIPATION PLATE AND METHOD FOR MANUFACTURING HEAT DISSIPATION PLATE
Document Type and Number:
WIPO Patent Application WO/2021/015007
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a heat dissipation plate and method for manufacturing the same enabling the heat dissipation plate to have suitable low-thermal expansion characteristics while mitigating anisotropy of the thermal conductivity in the planar directions (length direction, width direction) and the thickness direction. This heat dissipation plate is formed from a high thermal conductivity section formed from a high thermal conductivity material and a plurality of low thermal expansion sections formed from a low thermal expansion material, and the plurality of low thermal expansion sections are respectively positioned consecutively in a line along the longitudinal direction of the high thermal conductivity material and so as to be in a mutual non-contact state in the longitudinal direction, the width direction, and the thickness direction of the high thermal conductivity section. This heat dissipation plate can be created by a manufacturing method which involves: positioning low thermal expansion sections (a plurality of core materials) consecutively in a line along the longitudinal direction of a high thermal conductivity section and so as to be in a mutually non-contact state in the longitudinal direction, the width direction, and the thickness direction of the high-thermal conductivity section to produce a composite wire thread material; flattening the composite wire thread material to obtain a composite wire material; and furthermore, rolling the composite wire material and shaping the same into a plate shape.

Inventors:
MIYASHITA KATSUMI (JP)
KODAMA KENJI (JP)
TONOGI TATSUYA (JP)
Application Number:
PCT/JP2020/027034
Publication Date:
January 28, 2021
Filing Date:
July 10, 2020
Export Citation:
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Assignee:
HITACHI METALS LTD (JP)
International Classes:
H01L23/373; B21B1/38; H05K7/20
Foreign References:
JPH10233474A1998-09-02
JPH07211818A1995-08-11
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