HEAT DISSIPATION STRUCTURE AND POWER MODULE

Title:

HEAT DISSIPATION STRUCTURE AND POWER MODULE

Document Type and Number:

WIPO Patent Application WO/2022/000940

Kind Code:

A1

Abstract:

A heat dissipation structure, comprising a first heat sink (1), used to dissipate heat for first power units (4), and provided with a first heat dissipation base (11) provided with first heat dissipation fins (12); a second heat sink (2), provided opposite to the first heat sink (1), used to dissipate heat for second power units (5), and provided with a second heat dissipation base (21) provided with second heat dissipation fins (22); and a heat conduction unit, having two surfaces that are facing away from and parallel to each other respectively attached to opposite end faces of the first heat dissipation base (11) and the second heat dissipation base (21), and used to conduct heat between the first heat sink (1) and the second heat sink (2). Further provided is a power module using the described heat dissipation structure. The heat of the first heat sink (1) and the second heat sink (2) in the heat dissipation structure and the power module are in communication, reducing local high-temperature points of the first power units (4) and the second power units (5), such that the temperature is more balanced, thereby being able to cope with different extreme working conditions, and improving the heat dissipation efficiency under the same cost condition.

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Inventors:

LU YUJIE (CN)
FU WEIKUN (CN)
NI ZELIAN (CN)
ZHAO XIAOHANG (CN)

Application Number:

PCT/CN2020/129299

Publication Date:

January 06, 2022

Filing Date:

November 17, 2020

Export Citation:

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Assignee:

KEHUA HENGSHENG CO LTD (CN)
ZHANGZHOU KEHUA TECHNOLOGY CO LTD (CN)

International Classes:

H01L23/367

Foreign References:

CN111816630A	2020-10-23
CN110519967A	2019-11-29
CN209297181U	2019-08-23
CN107819172A	2018-03-20
CN210042701U	2020-02-07
US10424532B2	2019-09-24

Attorney, Agent or Firm:

HARBIN SONGHUAJIANG PATENT TRADEMARK OFFICE (CN)

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