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Title:
HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2014/010210
Kind Code:
A1
Abstract:
The disclosed heat exchanger (100) exchanges heat between a first fluid and a second fluid. The heat exchanger (100) is provided with: a resin structure (10) forming a first channel channeling the first fluid; and a copper pipe (20) forming a second channel channeling the second fluid, at least a part of the copper pipe (20) being disposed in the first channel. The resin component of the resin composition constituting the resin structure (10) has, as the principal component, a polymer alloy of a polyphenylene ether resin and a polystyrene resin. In the polymer alloy, the mass ratio between the polyphenylene ether resin and the polystyrene resin is in the range of 40/60 to 65/35.

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Inventors:
SUZUKI MOTOHIRO
MORIMOTO SATORU
HOTEHAMA KENICHI
Application Number:
PCT/JP2013/004166
Publication Date:
January 16, 2014
Filing Date:
July 04, 2013
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
F28F21/06; C08L25/06; C08L71/12
Foreign References:
JP2002333290A2002-11-22
JP2003247746A2003-09-05
JP2010078094A2010-04-08
JP2007225206A2007-09-06
JPH02214646A1990-08-27
JP2005214466A2005-08-11
JP2009281636A2009-12-03
JPH11189690A1999-07-13
JP2000048774A2000-02-18
JP2002333290A2002-11-22
JP2006078082A2006-03-23
Other References:
See also references of EP 2873941A4
Attorney, Agent or Firm:
KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)
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