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Patent Searching and Data


Title:
HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2021/229937
Kind Code:
A1
Abstract:
The present invention provides a heat exchanger having superior heat resistance, LLC (antifreeze) resistance, water resistance, and durability. A heat exchanger 1 according to the present invention is characterized by comprising an outer package member 2 which is provided with a heat-medium inlet 24 and a heat-medium outlet 25, and in which a heat medium, that has flowed in from the heat-medium inlet 24, flows therein and flows out from the heat medium outlet 25, wherein the outer package member 2: is constituted by outer package laminate members L1 that contain a metal heat-transfer layer 51 and a thermal fusion layer 53 made of resin and provided on one surface of the heat-transfer layer 51; is formed as a result of the outer package laminate members L1 being overlapped and the thermal fusion layers 53 being joined together and integrated along the peripheral edges thereof; and is such that the thermal fusion layer 53 and the heat-transfer layer 51 of the outer package laminate members L1 are laminated via an inner adhesive layer 52 constituted of an acid-modified polyolefin adhesive containing an acid-modified polyolefin resin.

Inventors:
MINAMITANI KOJI (JP)
KUMAKI TERUTOSHI (JP)
Application Number:
PCT/JP2021/013271
Publication Date:
November 18, 2021
Filing Date:
March 29, 2021
Export Citation:
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Assignee:
SHOWA DENKO PACKAGING CO LTD (JP)
International Classes:
F28F21/06; B32B15/08; C09J123/26; H01L23/473
Domestic Patent References:
WO2018116555A12018-06-28
WO2018221037A12018-12-06
Foreign References:
JP2020003132A2020-01-09
JP2014120277A2014-06-30
JP2020003132A2020-01-09
JP2020084937A2020-06-04
Attorney, Agent or Firm:
SHIMIZU Yoshihito et al. (JP)
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