Title:
HEAT-EXPANDABLE MICROSPHERES AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/150951
Kind Code:
A1
Abstract:
The purpose of the present invention provides: heat-expandable microspheres which give hollow resin particles that can be inhibited from suffering shell breakage or deformations, e.g., a dent, under a high pressure load; and a use of the heat-expandable microspheres. The heat-expandable microspheres of the present invention are each configured of a shell comprising a thermoplastic resin and a blowing agent which is enclosed in the shell and which gasifies upon heating, the thermoplastic resin being a polymer of polymerizable ingredients including a crosslinkable monomer (A) having a molecular weight of 500 or higher and having at least two (meth)acryloyl groups and a reactive carbon-carbon double bond besides the (meth)acryloyl groups.
Inventors:
TAYAGAKI NAOYA (JP)
MIKI KATSUSHI (JP)
MIKI KATSUSHI (JP)
Application Number:
PCT/JP2019/001096
Publication Date:
August 08, 2019
Filing Date:
January 16, 2019
Export Citation:
Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
International Classes:
C08F136/22; C09K3/00; C08J3/12; C08J9/32
Domestic Patent References:
| WO2007046273A1 | 2007-04-26 | |||
| WO2017014064A1 | 2017-01-26 | |||
| WO2014157188A1 | 2014-10-02 |
Foreign References:
| JP2015003951A | 2015-01-08 | |||
| JP2012102288A | 2012-05-31 |
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