Title:
HEAT-FUSABLE LAMINATED ORIENTED FILM
Document Type and Number:
WIPO Patent Application WO/2022/137867
Kind Code:
A1
Abstract:
Provided are a heat-fusable laminated oriented film having sufficient mechanical properties, high durability in a moist and hot environment, high adhesion at a lamination interface, and a good bonding state at the time of thermal bonding, and a wound roll thereof. In the heat-fusable laminated oriented film according to the present invention, heat-fusable layers including a heat-fusable polyolefin resin are provided by coextrusion so as to be in direct contact on both sides of a base material layer composed of a resin composition including 60-99.9% by mass of a polyamide resin or a polymethylpentene resin and 0.1-40% by mass of a modified polyolefin resin, and where the longitudinal, width, and thickness directions are defined as an X axis, an Y axis, and a Z axis, respectively, the film is stretch-oriented in the X-axis and/or Y-axis direction, and a thermal deformation rate at 150°C in both the X-axis and the Y-axis directions is 3% or less.
Inventors:
TANAKA YOSHITAKA (JP)
WATANABE SHIGEYUKI (JP)
YOSHIMURA NOBUHIRO (JP)
UMEKI RYO (JP)
MASUDA TAKAFUMI (JP)
FUNAOKA DAIKI (JP)
WATANABE SHIGEYUKI (JP)
YOSHIMURA NOBUHIRO (JP)
UMEKI RYO (JP)
MASUDA TAKAFUMI (JP)
FUNAOKA DAIKI (JP)
Application Number:
PCT/JP2021/041524
Publication Date:
June 30, 2022
Filing Date:
November 11, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B29C55/02; B29C48/08; B29C48/21; B29C55/04; B29C55/12; B32B27/32; C09J7/25; C09J7/35; C09J123/00; C09J123/26
Domestic Patent References:
WO2020145239A1 | 2020-07-16 | |||
WO2019078134A1 | 2019-04-25 |
Foreign References:
JP2013185051A | 2013-09-19 | |||
JPH03224735A | 1991-10-03 | |||
JP2009083478A | 2009-04-23 | |||
JP2000079669A | 2000-03-21 | |||
JPH06155684A | 1994-06-03 | |||
JPH0929908A | 1997-02-04 | |||
JP2017036354A | 2017-02-16 | |||
JP6331468B2 | 2018-05-30 | |||
JP2530732B2 | 1996-09-04 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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