Title:
HEAT PIPE COOLANT AND FLAT PLATE-LIKE HEAT PIPE
Document Type and Number:
WIPO Patent Application WO/2022/080073
Kind Code:
A1
Abstract:
The present invention provides: a heat pipe coolant which can suppress deformation of a flat plate-like heat pipe; and a flat plate-like heat pipe. The heat pipe coolant is sealed in a flat plate-like heat pipe as a thermal diffusion plate. The heat pipe coolant comprises water and a deformation suppression agent which lowers hardness when the water freezes, wherein the deformation suppression agent is 1,4- dioxane or diethylene glycol dimethyl ether, the water is contained in an amount of not less than 90 wt%, and the deformation suppression agent is contained in an amount of not less than 0.5 wt%.
Inventors:
NAKAYAMA TOORU (JP)
FUKUNAGA RINKOU (JP)
FUKUNAGA RINKOU (JP)
Application Number:
PCT/JP2021/033867
Publication Date:
April 21, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
MONATEC CO LTD (JP)
International Classes:
F28D15/02; C09K5/04; H01L23/427; H05K7/20
Domestic Patent References:
| WO2019124359A1 | 2019-06-27 | |||
| WO2021085134A1 | 2021-05-06 |
Foreign References:
| JP2020125389A | 2020-08-20 | |||
| JP6704545B1 | 2020-06-03 | |||
| JP2013249326A | 2013-12-12 | |||
| JPH08259930A | 1996-10-08 | |||
| JP2005009752A | 2005-01-13 | |||
| JP2009236362A | 2009-10-15 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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