Title:
HEAT PIPE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/064989
Kind Code:
A1
Abstract:
This heat pipe is provided with a container having sealed therein a heat storage material comprising a thermosensitive polymer gel that comprises a thermosensitive polymer and a solvent selected from the group consisting of water, organic solvents, and compounds of water or of an organic solvent. The heat storage material changes in a reversible manner between being hydrophilic and being hydrophobic with a lower limit critical solution temperature serving as a boundary therebetween. The solvent included in the thermosensitive polymer gel maintains a liquid state while the heat storage material is in the process of changing between being hydrophilic and being hydrophobic.
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Inventors:
TERAI MAMORU (JP)
NOBUTOKI HIDEHARU (JP)
OHO TAKUMI (JP)
NOBUTOKI HIDEHARU (JP)
OHO TAKUMI (JP)
Application Number:
PCT/JP2019/039327
Publication Date:
April 08, 2021
Filing Date:
October 04, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C09K5/14; F28D15/02; F28D20/00; H01L23/427; H05K7/20
Domestic Patent References:
WO2019159514A1 | 2019-08-22 |
Foreign References:
JP6501990B1 | 2019-04-17 | |||
JP2007044673A | 2007-02-22 | |||
JP2006232940A | 2006-09-07 | |||
JP2017222742A | 2017-12-21 | |||
CN101117572A | 2008-02-06 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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