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Patent Searching and Data


Title:
HEAT PUMP AND CONTROL METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/030815
Kind Code:
A1
Abstract:
The present disclosure relates to a heat pump, a control method of the heat pump, and a home appliance including the heat pump, the heat pump comprising: a refrigerant circulation flow path for forming a flow path through which a refrigerant circulates; a first heat exchanger positioned in the refrigerant circulation flow path to cool air through heat exchange with the refrigerant; a second heat exchanger positioned in the refrigerant circulation flow path to heat air having passed through the first heat exchanger through heat exchange with the refrigerant; a compressor positioned in the refrigerant circulation flow path to compress and circulate the refrigerant passed through the first heat exchanger; an expansion unit positioned between the first heat exchanger and the second exchanger in the refrigerant circulation flow path to expand the refrigerant; and a heating unit positioned between the compressor and the second heat exchanger in the refrigerant circulation flow path to heat the refrigerant.

Inventors:
BYOUN YOUNGMIN (KR)
JUNG SUNGCHAN (KR)
KIM DAEHYUN (KR)
Application Number:
PCT/KR2021/009308
Publication Date:
February 10, 2022
Filing Date:
July 20, 2021
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
International Classes:
F25B30/02; D06F58/20; D06F58/40; D06F58/48; F25B49/02
Foreign References:
KR20030042837A2003-06-02
JP2013123443A2013-06-24
JP2019118833A2019-07-22
KR20110043084A2011-04-27
EP2540905A12013-01-02
Attorney, Agent or Firm:
KBK & ASSOCIATES (KR)
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