Title:
HEAT PUMP CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074322
Kind Code:
A1
Abstract:
A heat pump cycle device according to the present invention includes a compressor (11), a branch portion (12a), a heating unit (13, 30), a heating-unit-side depressurizing unit (14c, 14e), a bypass channel (21a), a bypass-side flow rate adjusting unit (14d), a mixing unit (12f), a target temperature deciding unit (S3) that decides a target temperature (TAO) that is a target value for an object temperature (TAV) of an object to be heated, and a target low pressure deciding unit (S11) that decides a target low pressure (PSO) that is a target value of an intake refrigerant pressure (Ps) of a refrigerant. When the object temperature (TAV) is lower than the target temperature (TAO) while executing a hot gas mode in which the object to be heated is being heated, high-pressure boosting control, in which discharge refrigerant pressure (Pd) of the refrigerant flowing into the heating unit (13, 30) is boosted, is executed.
Inventors:
KAMI YUICHI (JP)
TAKEICHI KOTA (JP)
TAKEICHI KOTA (JP)
Application Number:
PCT/JP2022/037630
Publication Date:
May 04, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F25B1/00; F25B41/42; F25B47/02
Foreign References:
| JP2019090595A | 2019-06-13 | |||
| JP2011257100A | 2011-12-22 | |||
| JP2015064169A | 2015-04-09 | |||
| JP2020122621A | 2020-08-13 |
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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