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Title:
HEAT PUMP DEVICE AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/064992
Kind Code:
A1
Abstract:
A heat pump device equipped with a heat storage tank for storing a heat-storing material having a thermosensitive polymer gel which contains a thermosensitive polymer which exhibits hydrophilic and hydrophobic properties depending on the temperature thereof, and also contains a solvent selected from the group consisting of water, an organic solvent and a mixture thereof, and further equipped with a heat-storing heat source device for heating the heat-storing material, a water tank for storing water, and a passage pipe for connecting the heat storage tank and the water tank to one another, wherein the heat-storing material reversibly changes between hydrophilic and hydrophobic properties at the boundary of the lower-limit critical solution temperature thereof, and during the process of said change, the organic solvent contained in the thermosensitive polymer gel maintains a liquid state, and the water and the thermosensitive polymer which has changed to become hydrophobic separate from one another.

Inventors:
TERAI MAMORU (JP)
NOBUTOKI HIDEHARU (JP)
OHO TAKUMI (JP)
Application Number:
PCT/JP2019/039330
Publication Date:
April 08, 2021
Filing Date:
October 04, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C09K5/14; F25B17/02; F28D20/00
Domestic Patent References:
WO2019159514A12019-08-22
Foreign References:
JP6501990B12019-04-17
JP2007044673A2007-02-22
JP2006232940A2006-09-07
JP2017222742A2017-12-21
CN101117572A2008-02-06
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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