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Patent Searching and Data


Title:
HEAT PUMP
Document Type and Number:
WIPO Patent Application WO/2021/172868
Kind Code:
A1
Abstract:
The present disclosure includes a first pipe in which a first refrigerant flow; a second pipe disposed at the side of the first pipe and in which a second refrigerant flow; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchange heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flow; a compressor connected with the second pipe and compressing the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchange heat with an outdoor air; a bypass pipe branched from first pipe and disposed to exchange heat with the second heat exchanger; and a three-way valve for inducing the first refrigerant to pass through the bypass pipe. According to the present disclosure, when the outdoor heat exchanger operates as an evaporator, the frost formation thereon may be prevented.

Inventors:
LEE YOUNGMIN (KR)
RYU JIHYEONG (KR)
CHO EUNJUN (KR)
KIM MINSOO (KR)
Application Number:
PCT/KR2021/002317
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
International Classes:
F25B30/02; F24H4/00; F25B9/00; F25B13/00; F25B43/00; F25B47/00; F25B47/02; F28D9/00
Foreign References:
KR100643689B12006-11-10
CN204006655U2014-12-10
JPH09280698A1997-10-31
US20100064699A12010-03-18
US20100077788A12010-04-01
Attorney, Agent or Firm:
PARK, Byung Chang (KR)
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